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Formula and preparation method of high-molecular LED (Light Emitting Diode) radiation material

A heat-dissipating material and polymer technology, which is applied to the formulation of polymer LED heat-dissipating materials and the field of preparation thereof, can solve the problems of hindering heat dissipation of high-power LED lamps, complicated molding process, and high cost, and achieves light weight, simple molding process, and high cost. low cost effect

Active Publication Date: 2013-06-05
厦门恒宇星光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the popularization of LED application in the lighting field, the heat dissipation problem of high-power LED lamps has become an obstacle to its further development. Most of the existing LED lamp radiators use aluminum structures with heat dissipation fins, and their molding process is relatively Complex, heavy, and expensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The filler includes graphite powder and acetylene carbon black at a ratio of 1:1, dried at 120°C for 30 minutes and cooled to 25°C for use;

[0028] Component A includes: 665 organosilicon epoxy resin 80kg, FB high temperature resistant flame retardant thermosetting phenolic resin 20kg, filler 20kg, mix 665 organosilicon epoxy resin and FB high temperature resistant flame retardant thermosetting phenolic resin at 25℃~30℃ After uniformity, add the filler slowly and stir well until it is evenly mixed and set aside;

[0029] Component B includes: 200# low molecular weight polyamide 20kg, polyethylene polyamine (PEPA) 12kg, N-303 trihydroxy polyether polyol 37kg, DMP-302, 4,6-tris(dimethylaminomethyl)phenol 3kg, KH-550 coupling agent 0.5kg, zinc powder 1kg, antioxidant 1010 0.1kg, ultraviolet absorber UV-327 0.1kg, filler 46kg, put the components except filler at 25℃~30℃ After stirring evenly, add the filler slowly and stir well until it is evenly mixed and set aside;

[...

Embodiment 2

[0032] The filler includes graphite powder, polyphenylene powder and acetylene carbon black at a ratio of 1:1:1, dried at 110°C for 40 minutes and cooled to 25°C for use;

[0033] Component A includes 85kg of 665 organosilicon epoxy resin, 25kg of FB high temperature resistant flame retardant thermosetting phenolic resin, 25kg of filler, stir 665 organosilicon epoxy resin and FB high temperature resistant flame retardant thermosetting phenolic resin at 25℃~30℃ Then add the filling slowly and stir well until it is evenly mixed and ready for use;

[0034] Component B includes 200# low molecular weight polyamide 25kg, polyethylene polyamine (PEPA) 14kg, N-303 trihydroxy polyether polyol 40kg, DMP-302, 4,6-tris(dimethylaminomethyl)phenol 4kg , KH-550 coupling agent 0.6kg, zinc powder 1.1kg, antioxidant 1010 0.09kg, ultraviolet absorber UV-327 0.12kg, filler 48kg, put the components except filler at 25℃~30℃ After stirring evenly, add the filler slowly and stir well until it is eve...

Embodiment 3

[0037] The filler includes ultra-fine ferrophosphorus powder and acetylene carbon black at a ratio of 1:1, dried at 115°C for 40 minutes and cooled to 25°C for use;

[0038] Component A includes 75kg of 665 organosilicon epoxy resin, 15kg of FB high temperature resistant flame retardant thermosetting phenolic resin, 15kg of filler, stir 665 organosilicon epoxy resin and FB high temperature resistant flame retardant thermosetting phenolic resin at 25℃~30℃ Then add the filling slowly and stir well until it is evenly mixed and ready for use;

[0039] Component B includes 15kg of 200# low-molecular polyamide, 10kg of polyethylene polyamine (PEPA), 35kg of N-303 trihydroxy polyether polyol, DMP-302, 2kg of 4,6-tris(dimethylaminomethyl)phenol , KH-550 coupling agent 0.4kg, zinc powder 0.9kg, antioxidant 1010 0.12kg, ultraviolet absorber UV-327 0.08kg, filler 44kg, put the components except filler at 25℃~30℃ After stirring evenly, add the filler slowly and stir well until it is even...

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Abstract

The invention discloses a high-molecular LED (Light Emitting Diode) radiation material. The high-molecular LED radiation material disclosed by the invention has the advantages of simpler preparation process and forming process, low cost, light weight and high heat-conducting velocity; and a radiator manufactured through a formula can be used for a long time at 200 DEG C and is more than 8 years in aging life.

Description

technical field [0001] The invention relates to a formula of a polymer heat dissipation material and a preparation method thereof. Background technique [0002] With the popularization of LED application in the field of lighting, the heat dissipation problem of high-power LED lamps has become an obstacle to its further development. Most of the existing LED lamp radiators use aluminum structures with heat dissipation fins, and their molding process Complicated, heavy and expensive. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a formula and a preparation method of polymer LED heat dissipation material, which are convenient to prepare, simple in production process, and have good heat dissipation effect of the manufactured radiator. [0004] In order to solve the above-mentioned technical problems, the present invention provides a formula for polymer LED heat dissipation materials, the formula includes component...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C09K5/14C08K13/02C08K3/08C08K3/04C08K3/32C08G59/62C08G59/60F21V29/00F21Y101/02F21V29/85F21Y115/10
Inventor 李勇杰
Owner 厦门恒宇星光电科技有限公司
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