Environment-friendly plate material compounded by organic silicon modified epoxy resin and waste circuit board non-metallic powder

Abstract

The invention provides environment-friendly plate material compounded by waste circuit board non-metallic powder. The components of the environment-friendly plate material comprise, by weight, 15-25 parts of dimethyl dichloride silane modified epoxy resin and 70-80 parts of recovered waste circuit board powder. The environment-friendly plate material is good in strength, toughness, water-proof and heat-proof performance, corrosion-proof performance, environment-friendly performance and the like, and capable of being used as replacements for traditional building and decoration purpose plate material. 3-5 parts of hexamethylenetetramine curing agent, 3-5 parts of gamma-aminopropyl triethoxy silane coupling agent, 3-5 parts of dispersant and 1-2 parts of zinc stearate further can be added to the environment-friendly plate material, the compounded plate material is enabled to have better strength, processability, hot-water-resistance and gloss.

Description

technical field [0001] The invention relates to the field of environment-friendly boards, in particular to an environment-friendly board synthesized by utilizing waste metal powder of waste circuit boards. Background technique [0002] The raw material of the base plate of traditional wood products is wood, which needs to cut down forest resources, resulting in soil erosion, affecting the balanced development of the natural environment and ecology, not environmentally friendly and unable to effectively save energy and reduce emissions. [0003] With the rapid development of global electronic technology, industrial waste and domestic waste continue to be produced, resulting in a large amount of circuit board waste and leftovers in the global electronic waste and electronic industry production fields. Some studies have broken waste circuit boards into powder and then added them to bond However, most of the adhesives currently used are aldehyde-based adhesives such as phenolic ...

AI Technical Summary

Problems solved by technology

[0002] The raw material of the base plate of traditional wood products is wood, which needs to cut down forest resources, which will cause soil erosion and affect the balanced development of the natural environment and ecology. It is not environmentally friendly and cannot effectively save energy and reduce emissions.

[0003] With the rapid development of global electronic technology, industrial waste and domestic waste continue to be produced, resulting in a large amount of circuit board waste and leftovers in the global electronic waste and electronic industry production fields. Some studies have broken waste circuit boards into powder and then added them to bond However, most of the adhesives currently used are aldehyde-based adhesives such as phenolic resins, which are harmful to human health and the natural environment; some of the non-formaldehyde adhesives used have poor heat resistance and water resistance. Can not meet the use requirements

Thereby limiting the recycling of waste circuit board powder

[0004] As an adhesive with less environmental pollution, epoxy resin has excellent physical and mechanical properties and electrical properties, and is widely used in coatings, adhesives, electronic packaging materials, etc. Brittle, poor resistance to impact and stress cracking, which limits its application

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