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A micro-nano composite porous copper surface structure and its preparation method and device

A technology of surface structure and porous copper, applied in the direction of nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of high cost, poor controllability, complex process, etc., to achieve enhanced mechanical properties, The effect of preventing mutual interference

Active Publication Date: 2015-08-26
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many preparation methods for porous metal copper, including powder metallurgy, casting, sintering, dealloying, metal deposition, molten metal foaming, etc., but these methods are either high in cost, complicated in process, or prepared The porous copper structure is not uniform and the controllability is poor

Method used

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  • A micro-nano composite porous copper surface structure and its preparation method and device
  • A micro-nano composite porous copper surface structure and its preparation method and device
  • A micro-nano composite porous copper surface structure and its preparation method and device

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Embodiment 1

[0031] An electrodeposition device for preparing a micro-nano composite porous copper surface structure such as figure 1 As shown, it includes an electrodeposition tank 1, an electrodeposition solution 2, a DC power supply 3, a cathode substrate 4 and an anode 5, the anode 5 and the cathode substrate 4 are respectively connected to the positive and negative poles of the DC power supply 3, the electrodeposition solution 2, the cathode substrate 4 and the anode 5 are placed in the electrodeposition tank 1, and the electrodeposition liquid 2 is immersed in the cathode substrate 4 and the anode 5.

[0032] The cathode base 4 and the anode 5 are copper columns and copper plates respectively. The cathode base 4 is placed at the bottom of the electrodeposition tank 1 . Both the cathode base 4 and the anode 5 are placed horizontally, so that the hydrogen bubbles on the surface of the cathode base are evenly distributed and separated, and mutual interference is prevented; the area of ​...

Embodiment 2

[0034] (1) Prepare electrodeposition solution. Electrodeposition solution 2 composition: CuSO 4 Concentration is 0.4mol / L, H 2 SO 4 The concentration is 1.5mol / L, and the additive is HCl and the concentration is 20mmol / L.

[0035] (2) Prepare the cathode substrate. The cathode substrate 4 is made of copper pillars, and the electrodeposition is only carried out on the dome surface. The dome surface is polished with 800-1000 mesh sandpaper, and methanol / nitric acid (V / V)=9 / 1 is used as the polishing liquid, and the voltage is 6-7V / cm 2 Perform electrolytic polishing and activate with 10wt% dilute sulfuric acid; coat the surface of the cathode substrate 4 that is not subjected to electrodeposition with silica gel 704.

[0036] (3) Prepare the anode. The anode 5 is made of red copper plate, and the area of ​​the anode should be large enough to obtain a uniform current density for the cathode substrate.

[0037] (4) Connection device. Press the device figure 1 connect.

[...

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Abstract

The invention relates to the preparation of a porous surface, and discloses a micro-nano composite porous copper surface structure and a preparation method and a preparation device thereof. The preparation method for the micro-nano composite porous copper surface structure is a method for electro-deposition by a hydrogen template method, takes red copper as an anode and a cathode substrate, and includes: performing electro-deposition by taking red copper as an anode and a cathode substrate, and the mixture consisting of the H2SO4 and CuSO4 aqueous solution and additives as the electro-deposition solution to obtain an electro-deposition sample, soaking the electro-deposition sample with deionized water and ethanol and then drying to obtain the micro-nano composite porous copper surface structure; and thermally treating the obtained micro-nano composite porous copper surface structure to enhance the mechanical performance of the micro-nano composite porous copper surface structure. The device for preparing the micro-nano composite porous copper surface structure comprises an electro-deposition tank, an electro-deposition solution, a direct current power supply, a cathode substrate and an anode. The preparation method is simple to operate, and low in cost, and the micro-nano composite porous copper surface structure is controllable; and by the method, a micro-nano composite structure formed by superposing a micrometer scale aperture structure and a wall nano dendrites structure can be prepared, and the aperture of the structure is gradually increased and the structure is uniform.

Description

technical field [0001] The invention relates to the preparation of porous surfaces, in particular to a micro-nano composite porous copper surface structure and its preparation method and device. Background technique [0002] Porous metal materials have the characteristics of large specific surface area and permeability, and can be fully contacted with gas or liquid phases. They have a wide range of applications in the fields of batteries, electrochemical capacitors, electrochemical sensors, chemical catalysis, and enhanced heat transfer boiling. Copper is an excellent heat transfer material, and its porous structure has obvious advantages in the field of enhanced boiling heat transfer. Due to the excellent electrical conductivity of porous copper, the application in electrode materials of nickel-zinc batteries and electric double-layer capacitors has also been paid attention to. There are many preparation methods for porous metal copper, including powder metallurgy, casting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D21/12C25D17/10B82Y40/00B82Y30/00
Inventor 汤勇缪利梅唐彪陆龙生万珍平袁伟
Owner SOUTH CHINA UNIV OF TECH
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