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Electrocoppering solution for filling blind microvia

A technology of electroplating copper and micro-blind vias, which is applied in liquid chemical plating, metal material coating technology, coating, etc., can solve the problems of thick copper plating surface deposition thickness, high product cost, and low plating solution life, and achieve The effect of small deposition thickness, long service life and large operating window

Inactive Publication Date: 2013-03-27
SHAANXI NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned system using PEG (polyethylene glycol) as an inhibitor will have defects such as thick copper plating surface deposition thickness, narrow additive operation window, and short service life of the plating solution, which will lead to high post-production costs and product costs. High, not suitable for mass production

Method used

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  • Electrocoppering solution for filling blind microvia
  • Electrocoppering solution for filling blind microvia
  • Electrocoppering solution for filling blind microvia

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Taking the preparation of 1L of electroplating copper solution for micropore filling as an example, the raw materials used and their mass ratios are:

[0030]

[0031]

[0032] The above-mentioned Poloxamer 181 (Poloxamer 181), as an inhibitor, is a kind of block polyether, and its number average molecular weight is 2000.

[0033] The preparation method of the electroplating copper solution for filling micro-blind holes is as follows: according to the mass ratio of the above raw materials, copper sulfate pentahydrate is added to the beaker, 900 mL of twice distilled water is added until the copper sulfate pentahydrate is completely dissolved, and then concentrated sulfuric acid is added. After being completely dissolved and the temperature of the solution drops to room temperature, add sodium chloride with a mass concentration of 0.04g / L, 3-mercapto-1-propanesulfonate with a mass concentration of 0.0003g / L, and 0.003g / L of Diazine black, 0.2g / L propylene oxide / but...

Embodiment 2

[0035] Taking the preparation of 1L of electroplating copper solution for micropore filling as an example, the raw materials used and their mass ratios are:

[0036]

[0037] The preparation method of the copper electroplating solution for filling blind microvias is the same as that in Example 1.

Embodiment 3

[0039] Taking the preparation of 1L of electroplating copper solution for micropore filling as an example, the raw materials used and their mass ratios are:

[0040]

[0041] The preparation method of the copper electroplating solution for filling blind microvias is the same as that in Example 1.

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Abstract

The invention relates to an electrocoppering solution for filling blind microvia. Materials of block polyether, poloxamers, amine block polyether or polyvinylpyrrolidone and the like are added into the electrocoppering solution to be used as an inhibitor so as to realize a synergistic effect with an accelerator of sodium 3, 3'-dithiodipropane sulfonate or 3-sulfhydryl group-1-propanesulfonate, a leveling agent of janus green and the like and chloride ions, so that the non-voidance, seamless and perfect electrocoppering filling of the blind microvia with different ratios of pit-depth to pit-diameter for an electroplating technology is realized. The electrocoppering solution has the advantages of stable quality, long service life, large concentration operation windows for various additives, small copper surface area thickness and the like.

Description

technical field [0001] The invention belongs to the technical field of micro-blind hole filling of printed circuit boards (PCB), and in particular relates to a method of realizing micro-blind holes through the synergistic effect of copolyether compounds or amide polymers, chloride ions, accelerators, and leveling agents. Electroplating copper solution for super electroplating filled blind microvias. Background technique [0002] With the rapid development of the electronic information industry, high-density, lightweight, and highly integrated printed circuit boards have become an inevitable demand for the industry. This makes the requirement for surface copper thickness thinner and thinner in the process of filling blind holes with acid copper. However, the current polyethylene glycol-chloride-polyethylene glycol-chloride-poly Sodium Dithiodipropane Sulfonate-Jenna Green (PEG-Cl-SPS-JGB) acidic electroplating copper system No matter how the concentration of the four additiv...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/04C23C18/38
Inventor 王增林路旭斌
Owner SHAANXI NORMAL UNIV
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