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Multiple-layer metallization processing method for epoxy resin package electronic component surface

An electronic component surface, epoxy resin technology, applied in metal material coating process, coating, superimposed layer plating, etc. good effect

Inactive Publication Date: 2013-02-20
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Dissecting the samples purchased from abroad shows that there is a nickel-gold plating layer on the surface of the packaged electronic components, but there is no mature technical report on the surface metallization process and technology of epoxy resin packaged electronic components in China; and as packaged electronic components need There are circuit board materials, alloy pins, fillers, etc. on the plated surface at the same time, so it is relatively difficult to plate at the same time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The multi-layer metallization treatment method on the surface of epoxy resin encapsulated electronic components includes the following steps: pin protection, degreasing, first hot water washing, first cold water washing, first distilled water washing, roughening, second Hot water washing, the second cold water washing, the second distilled water washing, the third hot water washing, the third cold water washing, ultrasonic cleaning, the third distilled water washing, pickling, pre-sensitization, activation, running water washing, degumming, The fourth cold water wash, the fourth distilled water wash, electroless nickel plating, the fifth distilled water wash, copper electroplating, the sixth distilled water wash, nickel electroplating, the seventh distilled water wash, drying and gold plating. in:

[0027] 1. Pin protection and degreasing, roughen the surface of epoxy resin encapsulated electronic components with fine sandpaper, then protect the pins, bind and hang them...

Embodiment 2

[0038] The multi-layer metallization treatment method on the surface of epoxy resin encapsulated electronic components comprises the following steps with embodiment 1;

[0039] 1. Pin protection and degreasing, roughen the surface of epoxy resin encapsulated electronic components with fine sandpaper, then protect the pins, bind and hang them in degreasing liquid, temperature 55℃, time 12min; degreasing liquid consists of 25g / L sodium hydroxide, 50g / L trisodium phosphate, 30g / L sodium carbonate, 8ml / L OP-10 emulsifier and deionized water. ;

[0040] 2. Soak the epoxy-encapsulated electronic components after the first distilled water wash in the roughening solution at a temperature of 65°C for 10 minutes; the roughening solution consists of 230g / L chromic anhydride and a mass fraction of 230g / L≥98% Concentrated sulfuric acid and hydrofluoric acid with a mass fraction of 8ml / L ≥ 40%; after chemical roughening, the corrosion products on the surface are thoroughly cleaned by ultr...

Embodiment 3

[0050] The multi-layer metallization treatment method on the surface of epoxy resin encapsulated electronic components comprises the following steps with embodiment 1;

[0051] 1. Pin protection and degreasing, roughen the surface of the epoxy resin encapsulated electronic components with fine sandpaper, then protect the pins, bind and hang them in the degreasing liquid, the temperature is 60°C, and the time is 10 minutes. The degreasing solution is composed of 30g / L sodium hydroxide, 60g / L trisodium phosphate, 40g / L sodium carbonate, 10ml / L OP-10 emulsifier and deionized;

[0052] 2. Soak the epoxy-encapsulated electronic components after the first distilled water wash in the roughening solution at a temperature of 70°C for 5 minutes. The roughening solution is composed of 250g / L chromic anhydride, 250g / L concentrated sulfuric acid with a mass fraction ≥ 98%, and 10ml / L hydrofluoric acid with a mass fraction ≥ 40%; after chemical roughening, thoroughly ultrasonically clean th...

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Abstract

The invention relates to a multiple-layer metallization processing method for an epoxy resin package electronic component surface. The method includes: first forming a chemical nickel-plating bottom plated layer on the epoxy resin package electronic component surface, and then forming a nickel and gold composite plated layer or a copper, nickel and gold composite plated layer on the chemical nickel-plating bottom plated layer. The detailed operation steps include: pin protection, oil removing, washing for the first time, coarsening, washing for the second time, ultrasonic washing, washing for the third time, pickling, pre-sensitizing, activating, washing with running water, peptizing, washing for the fourth time, chemical nickel-plating, washing for the fifth time, electro-coppering, washing for the sixth time, electro-nickeling, washing for the seventh time, drying and gold plating. By means of the method, coarsening liquid, pre-sensitizing liquid, activating liquid, chemical nickel-plating liquid, electro-coppering liquid and relevant process conditions are improved. The multiple-layer metal plating achieves non-falling during etching of circuits, is good in electric conduction and can be used as an electric conduction terminal of an electric component directly to achieve circuit design.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, and in particular relates to a multilayer metallization treatment method for the surface of an epoxy resin packaged electronic component. Background technique [0002] Electronic packaging protects circuit chips from the surrounding environment (including physical and chemical influences). At home and abroad, we have been focusing on the research of electronic packaging memory technology with high performance, strong reliability and small size. At present, multi-chip packaging collaborative design has become a development trend, and memory modules are formed by overlapping two chips or stacking multiple chips to meet To meet the needs of system functions, packaging is entering the development stage from planar packaging to three-dimensional packaging; however, there are still many challenges in terms of materials and processes for electronic packaging. A considerable part of multi-chip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/02C25D3/38
Inventor 舒霞黄新民吴玉程
Owner HEFEI UNIV OF TECH
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