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Lead-free aluminum solder wire and preparation method thereof

A tin wire and aluminum welding technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of flux leakage, poor solderability, product scrapping, etc., to reduce the scrap rate, reduce the difficulty of cleaning, The effect of saving tin solder

Active Publication Date: 2013-02-13
青岛英太克锡业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The invention provides a lead-free aluminum solder wire, which solves the problem of large spatter during welding, poor solderability and leakage of flux contained in the solder wire in the prior art, polluting the whole roll of products, serious problems lead to product scrapping and other problems

Method used

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  • Lead-free aluminum solder wire and preparation method thereof
  • Lead-free aluminum solder wire and preparation method thereof

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preparation example Construction

[0032] The preparation method of hydroxylamine fluoride comprises the following steps:

[0033] 1) In terms of weight percentage, take 1-5% of ethylenediamine, 3-30% of ethanolamine, 20-90% of diethanolamine and 5-80% of triethanolamine, and mix them uniformly to obtain a mixture;

[0034] 2) Neutralize the resulting mixture with hydrofluoric acid to a pH value of 6.5-8;

[0035] 3) Evaporate the above neutralized product at a temperature of 140-160°C for 3.5-4.5 hours.

[0036] The metal active salt is one or more of tin fluoride, stannous fluoride, stannous fluoroborate, stannous chloride, zinc fluoride, zinc fluoroborate, zinc chloride and bismuth chloride combination.

[0037] The activator is one or a combination of diethylamine hydrochloride, triethylamine hydrochloride, lithium fluoride, sodium fluoride, magnesium fluoride and aluminum fluoride.

[0038] The corrosion inhibitor is benzotriazole and / or piperazine.

[0039] A method for preparing lead-free aluminum so...

Embodiment 1

[0049]The preparation method of hydroxylamine fluoride, it may further comprise the steps:

[0050] 1) According to weight percentage, take ethylenediamine 1%, ethanolamine 30%, diethanolamine 64% and triethanolamine 5%, mix and stir evenly to obtain a mixture;

[0051] 2) neutralize the resulting mixture with hydrofluoric acid to a pH value of 6.5;

[0052] 3) Evaporate the above-mentioned neutralized product at 140°C for 4.5 hours to remove the moisture and prevent subsequent welding spatter.

Embodiment 2

[0054] The preparation method of hydroxylamine fluoride, it may further comprise the steps:

[0055] 1) According to weight percentage, take 5% ethylenediamine, 3% ethanolamine, 84% diethanolamine and 8% triethanolamine, mix and stir evenly to obtain a mixture;

[0056] 2) Neutralize the resulting mixture to a pH of 8 with hydrofluoric acid;

[0057] 3) Evaporate the above-mentioned neutralized product at 160°C for 3.5 hours to remove the moisture and prevent subsequent welding spatter.

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Abstract

The invention relates to a lead-free aluminum solder wire and a preparation method thereof. The lead-free aluminum solder wire comprises, by weight, 1.2-3.0% of metal components and 97-98.8% of soldering flux; the metal components comprise, by weight, 98-99.7% of tin and 0.3-2% of copper; and the soldering flux comprises, by weight, 60-85% of fluorination hydroxylamine, 5-30% of metal active salt, 1-5% of an active agent and 0.1-5% of a corrosion inhibitor. The lead-free aluminum solder wire is good in solderability, high in soldering efficiency which can be improved by over 10%, small in welding spattering and capable of lessening subsequent corrosion, reducing washing difficulties and saving precious tin solder, the soldering flux is not prone to leak and seep during storage, and problems that welding spattering is large, solderability is not high and soldering flux clamped in solder wires leak out to pollute the whole rolled products and even lead to product scrapping under serious conditions are solved.

Description

technical field [0001] The invention relates to a lead-free aluminum solder wire in the field of aluminum soldering in the electronic industry and a preparation method thereof. Background technique [0002] With the continuous development of electronic and electrical products in the direction of miniaturization, light weight, and low energy consumption, the materials used are required to be lighter and lighter, while still having good overall performance. Although copper has good electrical conductivity, thermal conductivity, corrosion resistance and excellent mechanical properties, it has been widely used in various industrial fields and its demand is increasing with the rapid development of the economy, but its reserves in nature Not much, mining and processing costs are high. Therefore, for a long time, people have been hoping to replace copper with light metals with similar properties and abundant reserves in some industrial fields. Aluminum and its alloys have the adv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/40
Inventor 王风田
Owner 青岛英太克锡业科技有限公司
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