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Preparation method of phenolic foam boards

A technology of phenolic foam board and phenolic resin, which is applied in the field of preparation of phenolic foam board, can solve problems such as the quality and safety impact of thermal insulation board building external wall external insulation engineering, and achieve the goal of improving the degree of curing, preventing warping and improving the degree of curing Effect

Active Publication Date: 2012-12-26
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The warping problem of the insulation board has a huge negative impact on ensuring the quality and safety of the building's external wall insulation project

Method used

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  • Preparation method of phenolic foam boards
  • Preparation method of phenolic foam boards

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preparation example Construction

[0021] The invention provides a kind of preparation method of phenolic foam board, comprises the following steps:

[0022] Mix 90-120 parts by weight of basic phenolic resin, 4-15 parts by weight of foaming agent, 2-6 parts by weight of emulsifier, 2-8 parts by weight of toughening agent, and 10-30 parts by weight of curing agent , heated and foamed, cured and formed, and finally post-cured at a temperature of 30°C to 80°C and a humidity of 40% to 90% for 24 to 72 hours to obtain a phenolic foam board.

[0023] As a preferred solution, the present invention firstly mixes phenolic resin, emulsifier, and toughening agent, then stirs at high speed evenly, then adds foaming agent and mixes evenly, foams, finally adds curing agent, mixes evenly and pours into the mold , the reaction temperature for curing and molding is preferably 40°C to 70°C, more preferably 50°C to 70°C, and most preferably 60°C to 70°C.

[0024] The phenolic resin used in the present invention is preferably an...

Embodiment 1

[0040] Calculated in parts by weight, each 1g is one part, weigh each component raw material:

[0041] 90g of expandable alkaline phenolic resin, 2g of polysiloxane, 2g of a mixture of ethylene glycol and polyethylene glycol in a volume ratio of 2:1, and a mixture of n-pentane and isopentane in a volume ratio of 1:1 4g of solution, 10g of mixed solution of p-toluenesulfonic acid and sulfuric acid with a volume ratio of 2:1, the amount of aluminum hydroxide is 5g, and the amount of polyurethane prepolymer is 3g.

[0042] Mix expandable alkaline phenolic resin, polysiloxane, a mixture of ethylene glycol and polyethylene glycol with a volume ratio of 2:1, aluminum hydroxide, and polyurethane prepolymer, stir evenly at high speed, and then add the volume ratio It is a 1:1 mixed solution of n-pentane and isopentane, mix evenly, make a phenolic resin foaming system, carry out foaming, and finally add a mixed solution of p-toluenesulfonic acid and sulfuric acid with a volume ratio of...

Embodiment 2

[0045] Calculated in parts by weight, each 1g is one part, weigh each component raw material:

[0046] 110g of expandable alkaline phenolic resin, 6g of polysiloxane, 8g of a mixed solution of ethylene glycol and polyethylene glycol in a volume ratio of 2:1, and a mixture of n-pentane and isopentane in a volume ratio of 1:1 15g of solution, 30g of mixed solution of p-toluenesulfonic acid and sulfuric acid with a volume ratio of 2:1, 30g of aluminum hydroxide, and 20g of polyurethane prepolymer.

[0047] Mix expandable alkaline phenolic resin, polysiloxane, a mixture of ethylene glycol and polyethylene glycol with a volume ratio of 2:1, aluminum hydroxide, and polyurethane prepolymer, stir evenly at high speed, and then add the volume ratio It is a 1:1 mixed solution of n-pentane and isopentane, mix evenly, make a phenolic resin foaming system, carry out foaming, and finally add a mixed solution of p-toluenesulfonic acid and sulfuric acid with a volume ratio of 2:1, mix Pour e...

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Abstract

The invention provides a preparation method of phenolic foam boards. The method comprises the steps as follows: mixing 90 to 120 parts by weight of alkaline phenolic resin, 4 to 15 parts by weight of foaming agents, 2 to 6 parts by weight of emulsifiers, 2 to 8 parts by weight of flexibilizers and 10 to 30 parts by weight of curing agents so as to prepare a foaming system of the phenolic foam boards; heating for foaming; solidifying for shaping; and then post-solidifying so as to prepare the phenolic foam boards. The post-solidifying treatment is performed on the conditions that temperature is 30 to 80 DEG C, the humidity is 40 to 90%, and the time is 24 to 72 hours. The preparation method provided by the invention is realized by post-solidifying boards, and adding an inorganic fire retardant and a high-activity modifier to the foaming system of the phenolic foam boards so as to prepare phenolic foam boards with the warping dimension being equal to or less than 4 mm, the wall-mounting condition is good or the boards are warped slightly, and no dropping phenomenon occurs; therefore, the boards accord with the requirements for good boards in the markets, and the method solves the warping problem of the phenolic foam boards.

Description

technical field [0001] The invention relates to the technical field of building energy-saving new materials, in particular to a preparation method of a phenolic foam board. Background technique [0002] Exterior wall insulation is currently the most widely used energy-saving technical measure in my country's building wall energy-saving. This technology places the insulation layer outside the main wall material for insulation, which can reduce the impact of cold bridges. It is currently the most widely used insulation method. This technology has been vigorously advocated by the country. [0003] At present, the insulation materials used for external wall insulation include polystyrene foam board, polyurethane foam board, phenolic foam board and so on. With the improvement of the country's energy-saving requirements for buildings and other projects and the introduction of corresponding fire protection regulations, some traditional thermal insulation foam panels with low fire p...

Claims

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Application Information

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IPC IPC(8): C08J9/14C08J5/18C08L61/14C08L83/04C08L75/04C08K3/22C08K5/053
Inventor 江成真李枝芳秦海洋彭文杰焦壮
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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