Alumina-based ceramic, ceramic radiating substrate and preparation method for ceramic radiating substrate

A heat dissipation substrate and aluminum oxide technology, which is applied in the field of microelectronic materials, can solve the problems of poor heat dissipation performance of ceramic heat dissipation substrates, and achieve the effects of enhancing the overall heat dissipation capability, improving heat dissipation effect, and good heat dissipation performance

Active Publication Date: 2012-11-28
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention solves the technical problem of the poor heat dissipation performance of the ceramic heat dissipation substrate existing in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0033] Finally, the present invention provides a method for preparing a ceramic heat dissipation substrate, comprising the following steps:

[0034] A. Casting the upper ceramic slurry, after drying, punching and sintering the upper ceramic green body to obtain the upper ceramic green body; then setting through holes on the upper ceramic green body to form the upper ceramic green body with through holes to obtain the first layer;

[0035] B. The middle ceramic slurry is cast, dried and then punched and glued to obtain a middle ceramic green body; the lower ceramic slurry is casted, dried and then punched and glued to obtain a lower ceramic green body; the lower ceramic slurry is composed of lower ceramic A mixed system of powder and the first organic additive, the lower ceramic powder contains 80-100 parts by weight of alumina, 10-20 parts by weight of strontium lanthanum manganate and 5-50 parts by weight of sintering aid; manganic acid The chemical formula for strontium la...

Embodiment 1

[0054] (1) Disperse 100 parts by weight of LTCC glass powder in 60 parts by weight of organic additives (ethanol, xylene, polyvinyl butyral, and polyethylene glycol in a volume ratio of 10:10:1:1) to form Apply the ceramic slurry; then cast a ceramic film with a thickness of 0.5um, dry it at 60°C and punch it, then remove the glue at 850°C for 2 hours, and then sinter at 1650°C for 2 hours to obtain the upper ceramic green body; Via holes are cut on the ceramic green body to obtain the first layer.

[0055] (2) Disperse 100 parts by weight of alumina powder in 60 parts by weight of organic additives (ethanol, xylene, polyvinyl butyral, polyethylene glycol in a volume ratio of 10:10:1:1) to form medium ceramic slurry; then casting a ceramic film with a thickness of 0.5um, drying at 60°C and punching, and then debinding at 850°C for 2 hours to obtain a medium ceramic green body.

[0056] (3) 100 parts by weight of alumina, 15 parts by weight of strontium lanthanum manganate (La...

Embodiment 2

[0061] The same steps as in Example 1 were used to prepare the ceramic heat dissipation substrate S2 of this example, the difference being that:

[0062] In step (3), strontium lanthanum manganate (La x Sr 1-x MnO 3 , x=0.20) is used in an amount of 5 parts by weight.

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Abstract

The invention provides alumina-based ceramic. The alumina-based ceramic contains 100 weight parts of alumina, 10 to 20 weight parts of strontium lanthanum manganate and 5 to 50 weight parts of sintering aid; and the chemical formula of the strontium lanthanum manganate is LaxSr1-xMnO3, wherein x is 0.15 to 0.20. The invention also provides a ceramic radiating substrate using the alumina-based ceramic and a preparation method for the ceramic radiating substrate. The alumina-based ceramic has a good radiating effect, so that the ceramic radiating substrate using the alumina-based ceramic has good radiating performance.

Description

technical field [0001] The invention belongs to the field of microelectronic materials, and in particular relates to an alumina-based ceramic, a ceramic heat dissipation substrate and a preparation method thereof. Background technique [0002] With the increasingly urgent demand for LED lighting, the heat dissipation of high-power LEDs has received more and more attention. For high-power LEDs, usually 15% of the input energy is converted into light, and the remaining 85% is consumed in the form of heat. If the waste heat cannot be effectively dissipated, the junction temperature of the LED will be too high, which will affect the product life cycle, luminous efficiency and stability, and have a fatal impact on the life of the LED. For example, when the junction temperature of an LED rises from 25°C to 100°C, its luminous efficiency will decline by 20-75%. In addition, the operating environment temperature of the LED will also affect its lifespan. For example, when the opera...

Claims

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Application Information

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IPC IPC(8): C04B35/10C04B35/622H01L33/64
Inventor 徐斌向其军
Owner BYD CO LTD
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