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Slurry for preparation of glass fluorescent layer used for LED encapsulation

A technology of LED packaging and glass fluorescence, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of single type of fluorescence excitation, complex molding process, and inapplicability of preparation of fluorescent layers, etc., to avoid deliquescence and heat aging, and to achieve luminous performance Good, low technical cost effect

Inactive Publication Date: 2012-10-17
王双喜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Invention patent CN102121591A discloses a preparation method of LED light source and phosphor, which uses an integral glass phosphor to replace the traditional white LED organic packaging phosphor layer to solve the aging problem of white LED devices. Compared with the existing commercially available phosphor, The fluorescence excitation species proposed in this patent is single, and the germanate and tellurate glass systems used are expensive, and it is necessary to prepare an integral packaging glass fluorescent layer, and the molding process is complicated.
Invention patent CN101643315A discloses a method for preparing low-melting fluorescent glass for white light LEDs, but the formula B disclosed in the patent 2 o 3 And the content of sodium oxide is too high, it is easy to hydrolyze, and it is not suitable for the preparation of fluorescent layer by the coating process of water-based slurry

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Low melting point glass powder made of SiO 2 、Al 2 o 3 、K 2 CO 3 、H 3 BO 3 、TiO 2 , ZnO and Na 2 CO 3 and other raw materials, and the mass percentages of each component are shown in Table 1. Concrete preparation steps are as follows:

[0027] Weigh the raw materials according to the formula in Table 1, put them in a crucible after being ground and sieved, melt them at 1200°C and keep them warm for 1-2 hours, then quickly water-quench to obtain glass slag, dry them through a 50-mesh sieve, and put the sieved glass The granules were put into an agate ball mill jar and milled for 50 hours with ethanol as a ball milling aid, and then dried and sieved for later use. Take the prepared low-melting point glass powder and make slurry according to the formula shown in Table 2, put it in a polytetrafluoroethylene ball mill jar, and after ball milling for 3 hours, a slurry suitable for the spraying process is obtained. The slurry can be sprayed on the cordierite glass-c...

Embodiment 2

[0033] According to the formula in Table 3, the raw materials were converted, weighed and evenly mixed in a mortar, put into a corundum crucible, melted in a silicon-molybdenum rod electric furnace at 1250°C for 1-2 hours, and then poured into water and quenched into fine particles , dried through a 50-mesh sieve, put the sieved glass particles into an agate ball mill jar, and used ethanol as a ball milling aid for ball milling for 50 hours, then dried and sieved for later use. The prepared low-melting point glass powder was prepared into a slurry according to the formula shown in Table 4, placed in a polytetrafluoroethylene ball mill jar, and after ball milling for 3 hours, a slurry suitable for the printing process was obtained. The paste is printed on quartz glass, deglued at about 400°C, and sintered at 680°C.

[0034] table 3

[0035] Oxide composition

SiO 2

al 2 o 3

K 2 o

B 2 o 3

TiO 2

ZnO

Na 2 o

wt%

47.5...

Embodiment 3

[0039] According to the formula in Table 5, the raw materials used in Example 1 were converted, weighed and evenly mixed in a mortar, put into a corundum crucible, melted in a silicon-molybdenum rod electric furnace at 1350°C for 1-2 hours, and then poured into water Quenching into fine particles, drying through a 50-mesh sieve, putting the sieved glass particles into an agate ball mill jar and using ethanol as a ball milling aid for ball milling for 50 hours, then drying and sieving for later use. The prepared low-melting point glass powder was prepared into a slurry according to the formula shown in Table 6, placed in a polytetrafluoroethylene ball mill jar, and after ball milling for 3 hours, a slurry suitable for the printing process was obtained. The paste can be printed on transparent Al2O3 ceramics, debinding at about 400°C, and sintered at 700°C.

[0040] table 5

[0041] Oxide composition

SiO 2

al 2 o 3

K 2 o

B 2 o 3

TiO 2 ...

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Abstract

The invention provides a slurry for preparation of a glass fluorescent layer used for LED encapsulation. The slurry comprises glass powder with a low melting point, fluorescent powder and slurry additives. Low-melting-point glass has a softening temperature in a range of 630 to 700 DEG C. Through preparation of solution systems consisting of the glass powder with a low melting point, the fluorescent powder and other additives with different content, slurries with viscosity and luminescent properties meeting different coating processes and luminescence requirements can be obtained after ball milling of the solution systems. Through adjusting composition of the slurry for a glass fluorescent layer provided in the invention and glass, coating slurry with a the thermal expansion coefficient matching with a substrate can be prepared and can be printed onto the surface of substrates like glass and ceramics, and a glass fluorescent layer can be obtained after sintering of the printed substrates; the prepared glass fluorescent layer can be used to replace a silica gel or integral glass type white light LED fluorescent layer and enables the problems of easy aging and air-slaking of silica gel, high cost and complex preparation of the integral glass type white light LED fluorescent layer and the like to be overcome; the preparation process for the glass fluorescent layer prepared in the invention costs little, and the prepared glass fluorescent layer has good luminous performance and is applicable to the fields like packaging application of LEDs.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and mainly relates to the packaging technology of a high-power light-emitting diode (Light-Emitting Diode, LED) light source, especially the paste preparation technology. technical background [0002] White light diode lighting, also known as semiconductor white light lighting. LEDs that really emit white light do not exist, because LEDs are characterized by emitting only one wavelength, and it is necessary to use a reasonable combination of red, green, and blue semiconductor light-emitting diode chips to synthesize white light, or to emit blue light. It is covered with a conversion material (phosphor powder), which emits yellow light when excited by blue light, so that a mixture of blue and yellow light is obtained, which appears white to the naked eye. [0003] During the use of LEDs, the loss of photons generated by radiative recombination when they are emitted to the outside ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24C03C14/00H01L33/50
Inventor 王双喜王亚东欧阳雪琼郑琼娜
Owner 王双喜
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