Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Metamaterial base plate, preparation method thereof and prepared metamaterial antenna

A metamaterial and substrate technology, applied in the field of metamaterials, can solve the problems of being unsuitable for high integration and high power circuits, poor dielectric properties, high temperature resistance, low dielectric constant, etc. good thermal effect

Active Publication Date: 2012-10-10
KUANG CHI INST OF ADVANCED TECH
View PDF2 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the advantages of high resistivity, low dielectric constant and easy processing, polymers are often used as packaging materials or substrate materials, but they have poor thermal properties and are not suitable for high-heat, high-integration and high-power circuits.
[0004] Traditional substrate resins mostly use phenolic resin and epoxy resin. At present, glass fiber-reinforced epoxy resin board FR-4 is the most widely used. This material has the advantages of low manufacturing cost and high cost performance, and is relatively popular in low-frequency electronic products. Good application, but in high frequency circuits, due to its poor dielectric properties and high temperature resistance, FR-4 is not suitable for high frequency circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Prepare a polystyrene solution with a concentration of 15%;

[0021] Add alumina fibers to the polystyrene solution and stir to form a mixed solution, wherein the alumina fibers account for 10wt% of the polystyrene, and the length of the alumina fibers is 2mm;

[0022] Take one part of the mixed solution, one part of 10% N,N-dimethylaniline styrene solution, and one part of 1.2% dibenzoyl styrene peroxide solution, mix them well, pour them into the mold after stirring, and wait for the solvent After evaporation, hot pressing is performed at a hot pressing temperature of 75° C. and a hot pressing pressure of 1 MPa to obtain the prepared metamaterial substrate.

Embodiment 2

[0024] Prepare a polystyrene solution with a concentration of 20%;

[0025] Add alumina fibers to the polystyrene solution and stir to form a mixed solution, wherein the alumina fibers account for 2wt% of the polystyrene, and the length of the alumina fibers is 6mm;

[0026] Take one part of the mixed solution, one part of 1% cobalt naphthenate styrene solution, and one part of 0.95% cyclohexanone peroxide styrene solution, mix them well, pour them into the mold after the solvent evaporates, and heat press hot pressing, the hot pressing temperature is 100° C., and the hot pressing pressure is 0.5 MPa to obtain the prepared metamaterial substrate.

Embodiment 3

[0028] Prepare a polystyrene solution with a concentration of 22%;

[0029] Add alumina fiber to polystyrene solution and stir to form a mixed solution, wherein alumina fiber accounts for 18wt% of polystyrene, and the length of alumina fiber is 4mm;

[0030] Take one part of the mixed solution, two parts of 10% N,N-dimethylaniline styrene solution, and two parts of 1% dibenzoyl styrene peroxide solution, mix them well, pour them into the mold, wait for the solvent After evaporation, hot pressing is performed at a hot pressing temperature of 80° C. and a hot pressing pressure of 1.5 MPa to obtain the prepared metamaterial substrate.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Lengthaaaaaaaaaa
Lengthaaaaaaaaaa
Login to View More

Abstract

The invention provides a metamaterial base plate. Materials for preparing the metamaterial base plate include polystyrene and alumina fiber, wherein the alumina fiber accounts for 2 to 48 wt% of polystyrene. The invention also relates to a preparation method of the metamaterial base plate, and a metamaterial antenna prepared with the metamaterial base plate. The alumina fiber and polystyrene have low cost, and are simple in preparation technology, so the cost performance of the metamaterial base plate is high; the metamaterial base plate prepared with the alumina fiber serving as the filler of polystyrene has high heat resistance, low consumption and high strength; meanwhile, the metamaterial base plate is prepared with simple process and low cost; due to the high heat resistance, the metamaterial base plate can be applied to circuits with high temperature, high integrity level and high power; and the metamaterial base plate has low consumption and high strength, therefore, the requirement of the metamaterial antenna to the performance of the base plate can be met.

Description

【Technical field】 [0001] The invention relates to the field of metamaterials, in particular to a metamaterial substrate, a preparation method, and a prepared metamaterial antenna. 【Background technique】 [0002] Metamaterials are materials that can modulate electromagnetic waves developed in the past ten years. Metamaterials are generally composed of a certain number of metal microstructures attached to a substrate with certain mechanics and electromagnetism. These microstructures with specific patterns and materials can modulate electromagnetic waves of specific frequency bands passing through them. [0003] Electronic products are developing in the direction of thinning, high performance and multifunctionality. For this reason, substrate materials should not only have low dielectric constant and dielectric loss, but also have excellent thermal, electrical and mechanical properties. Due to the advantages of high resistivity, low dielectric constant and easy processing, pol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L25/06C08K7/08C08K3/22B29C43/58H01Q15/00
Inventor 刘若鹏季春霖李雪林云燕
Owner KUANG CHI INST OF ADVANCED TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com