Gallium-doped zinc oxide film, and preparation method and application thereof
A gallium-doped zinc oxide, thin film technology, applied in metal material coating process, vacuum evaporation coating, coating and other directions, can solve the problems of unstable conductivity and poor crystal quality of GZO thin films
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[0018] see figure 1 , showing a method for preparing a gallium-doped zinc oxide thin film according to an embodiment of the present invention, which includes the following steps:
[0019] S01: Ga 2 o 3 Powder and ZnO powder are mixed and sintered as GZO target material, the Ga 2 o 3 The mass ratio of the powder to the ZnO powder is 1 / 1999 to 1 / 99;
[0020] S02: Put the GZO target into the magnetron sputtering cavity, vacuumize, set the working pressure to 0.2Pa-1.5Pa, the inert gas flow rate to 15sccm-35sccm, the sputtering power to 60W-160W, and the sputtering Gallium zinc oxide thin film;
[0021] S03: Anneal the gallium-doped zinc oxide thin film prepared above, the annealing atmosphere is a mixed gas of inert gas and hydrogen, wherein the molar volume percentage of hydrogen is 5% to 30%, and the annealing temperature is 200°C to 600°C ℃.
[0022] In step S01, the Ga 2 o 3 Sinter at a temperature of 900°C to 1350°C to obtain a GZO ceramic target. Preferably, Ga 2...
Embodiment 1
[0030] Use Ga 2 o 3 :ZnO=1:999 (mass ratio) powder, after being evenly mixed, sintered at 1250°C at high temperature to form a Φ60×2mm ceramic target, and put the GZO target into the vacuum cavity. Then, the quartz substrate was ultrasonically cleaned with acetone, absolute ethanol and deionized water, dried with high-purity nitrogen, and placed in a vacuum chamber. The distance between the target and the substrate was set to 50mm. Use a mechanical pump and a molecular pump to evacuate the cavity to 6.0×10 -4 Pa, the argon gas of 20 sccm is introduced, and the pressure is adjusted to 1.0 Pa. The sputtering power of the GZO target is 100W, and the gallium-doped zinc oxide film is obtained by sputtering. After testing, its resistivity is 2.5×10 -2 Ω·cm. Then the obtained gallium-doped zinc oxide film is annealed with a mixed gas of argon and hydrogen, wherein the molar volume percentage of hydrogen is 5%, the annealing temperature is 300°C, the heating rate is 3°C / min, and ...
Embodiment 2
[0032] Use Ga 2 o 3 :ZnO=1:999 (mass ratio) powder, after being evenly mixed, sintered at 1250°C at high temperature to form a Φ60×2mm ceramic target, and put the GZO target into the vacuum cavity. Then, the quartz substrate was ultrasonically cleaned with acetone, absolute ethanol and deionized water, dried with high-purity nitrogen, and placed in a vacuum chamber. The distance between the target and the substrate was set to 50mm. Use a mechanical pump and a molecular pump to evacuate the cavity to 6.0×10 -4Pa, the argon gas of 20 sccm is introduced, and the pressure is adjusted to 1.0 Pa. The sputtering power of the GZO target was 100W, and the gallium-doped zinc oxide thin film was obtained by sputtering. Then the obtained gallium-doped zinc oxide film is annealed with a mixed gas of argon and hydrogen, wherein the molar volume percentage of hydrogen is 15%, the annealing temperature is 450°C, the heating rate is 4°C / min, and the holding time is 3h. The resistivity of...
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