Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Film coating method for electronic circuit board

An electronic circuit board and coating technology, which is applied in the field of electronic circuit board coating, can solve the problems of incompleteness and uneven coating, and achieve the effects of perfect waterproof, low processing cost, and uniform and complete coating layer

Inactive Publication Date: 2012-09-19
杨白
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The invention provides a coating method for electronic circuit boards, which can overcome the shortcomings of uneven and incomplete coatings in the prior art, and can better deal with the parts that need to be exposed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Film coating method for electronic circuit board
  • Film coating method for electronic circuit board
  • Film coating method for electronic circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0034] Such as figure 1 Shown is the used system diagram of the coating process of the present invention, which includes a storage container 1, vaporization chamber 2, cracking chamber 3, condensation equipment 4 and vacuum coating chamber 5 of the coating material p-xylene polymer connected in sequence.

[0035] Such as figure 2 Shown is a schematic diagram of the electronic circuit board after coating in this embodiment, which includes a PCB 6 , components 7 arranged on the PCB 6 and a coating 8 on the surface.

[0036] Preprocessing:

[0037] For the part of the electronic circuit board that does not need coating (that is, it needs to be exposed, and it will be connected with other components to make contacts, transmit signals, etc.) in the future, it must be coated with solder resist. There are parts or devic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a film coating method for an electronic circuit board. The film coating method comprises the steps of plating a film on the electronic circuit board under vacuum conditions and performing post-treatment, and specifically comprises the following steps: introducing a film-plating material which is vaporized and cracked by heating into a vacuum chamber placing the electronic circuit board, cooling the vacuum chamber, performing vacuum film plating operation on the surface of the electronic circuit board at normal temperature till the thickness of the plated film achieves the requirements, then taking out the electronic circuit board; then performing the post-treatment, that is, removing a film-plated layer at the part of the electronic circuit board, which is required to be exposed outside. Through the vacuum film-plating way, the film-plated layer is uniform and complete, the relatively complete waterproof, moisture-proof and anti-oxidation effects can be ensured, and even for all the small gaps and other dead points in the prior art, the effects are also good; and simultaneously, the processing cost is low, and the film coating method is suitable for mass production. The post-treatment process step can better treat the part to be exposed, and the follow-up processing and the use of the electronic circuit board can not be affected.

Description

technical field [0001] The invention relates to electronic circuit board technology, in particular to a film coating method for electronic circuit boards. Background technique [0002] Most of the current electronic products rely on the mold structure to achieve the waterproof and moisture-proof effect, but there are the following problems: [0003] 1. The appearance of the product is limited by the waterproof structure, which makes the appearance design of the product clumsy, and it is not easy to make it thin and short. [0004] 2. The design difficulty of appearance and mold is increased. [0005] 3. Additional waterproof material costs must be added. [0006] 4. The difficulty of product production and assembly is high, and the consistency of processing is poor. [0007] 5. The waterproof performance of the initial installation of the product cannot be achieved after after-sales maintenance. [0008] Another method is to directly use coating materials for waterproof ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/22C23C14/04C23C14/22
Inventor 蔡宏智
Owner 杨白
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com