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Composite silver wire

A silver wire and content technology, applied in metal/alloy conductors, electrical components, circuits, etc., can solve the problems of high cost of gold wires, workability (poor productivity, low yield, etc.), and achieve the effect of saving process costs.

Active Publication Date: 2012-07-18
SOLAR APPLIED MATERIALS TECHNOLOGY CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the high cost of gold wires, in order to save material costs, semiconductor companies have widely replaced gold wires with palladium-coated copper wires. The reliability (such as high temperature and high humidity resistance) can also meet the requirements. However, due to the high hardness of the palladium-plated copper wire, there are problems of poor workability (production capacity) and low yield. Therefore, for the semiconductor industry Said that the use of palladium-plated copper wire in wire-bond packaging technology can actually achieve cost savings that are not as good as expected

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  • Composite silver wire

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Embodiment Construction

[0009] The composite silver wire of the present invention contains gold, palladium, platinum, and other components such as silver.

[0010] Wherein, the weight percentage of gold is greater than or equal to 4wt% and less than 8wt%. If the gold content is lower than 4wt%, the hardness of the alloy of the present invention will be too high, which will easily lead to poor workability. If the gold content exceeds 8wt%, The workability and reliability of the composite silver wire of the present invention not only fail to be significantly improved, but also greatly increase the cost.

[0011] The weight percentage of palladium is between 2wt% and 4wt%. If the palladium content is lower than 2wt%, the composite silver wire of the present invention cannot pass the high temperature and high humidity reliability test. If the palladium content is higher than 4wt%, the composite silver wire of the present invention cannot Alloy hardness of the composite silver wire is too high, resulting ...

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Abstract

The invention provides a composite silver wire, which contains gold, palladium, and silver. The content of gold is greater than or equal to 4 wt % and less than 8 wt %. The content of palladium ranges from 2 wt % to 4 wt %. Therefore, the composite silver wire is excellent in general workability, high-temperature resistance and high-moisture resistance, and low in cost.

Description

technical field [0001] The invention relates to a composite silver wire, in particular to a composite silver wire used as a connecting wire for semiconductor packaging process. Background technique [0002] In the packaging process of semiconductor components, the wires used for wire bonding are divided into gold wires, copper wires and aluminum wires. Because gold wires have excellent physical properties, such as high stability, soft quality, good ductility, and good conductivity , its yield rate, production efficiency, and wire diameter miniaturization are also quite good, so gold wires are still used as the main wire bonding technology at present. [0003] However, due to the high cost of gold wires, in order to save material costs, semiconductor companies have widely replaced gold wires with palladium-coated copper wires. The reliability (such as high temperature and high humidity resistance) can also meet the requirements. However, due to the high hardness of the palla...

Claims

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Application Information

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IPC IPC(8): H01B1/02H01B13/00H01L23/48
CPCH01L24/45H01L2924/01029H01L2224/45144H01L2224/45139H01L2224/45147H01L24/43H01L2224/43H01L2224/43848H01L2224/45H01L2224/45015H01L2924/00011H01L2924/00014H01L2924/01047H01L2924/01079H01L2924/01046H01L2924/01042H01L2924/00015H01L2924/013H01L2924/00H01L2224/48H01L2924/01078H01L2924/00013H01L2924/01049H01L2924/01006H01L2924/01045H01L2924/00012H01L2924/01004C22C5/06
Inventor 洪飞义
Owner SOLAR APPLIED MATERIALS TECHNOLOGY CORPORATION
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