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Preparation method of polyamide heat-conducting wear-proof composite

A composite material and wear-resistant technology, which is applied in the preparation of polyamide thermally conductive and wear-resistant composite materials and the preparation of polyamide-amine-based composite materials, can solve the problem of unsatisfactory material properties, less research on polyamide, and limited applications. problems, to achieve the effect of increasing heat distortion temperature, wide application, and improving interface properties

Active Publication Date: 2012-07-18
嘉兴高正新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermally conductive and wear-resistant composite materials have certain application prospects in electronic packaging and mechanical manufacturing, but most of the substrates are epoxy or polyvinyl fluoride, and there are few studies on polyamides
And their research is to add conventional coupling agents to improve the interface performance between inorganic fillers and organic polymer matrix, the final material performance is not ideal, which limits its wider application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] In the first step, add 20 parts of silicon carbide, 2 parts of bisphenol A epoxy resin E-51, 2 parts of bisphenol A epoxy resin E-44, and 75 parts of acetone into the container, and stir for 1 hour under magnetic stirring , the rotation speed is 600 rpm, then add 0.8 parts of diethylenetriamine and 0.2 parts of n-butyl glycidyl ether, continue to stir for 3 hours, then stir for 1 hour at 60 ° C and 100 rpm, and the solvent will evaporate. The powder was dried in a vacuum oven at 30° C. for 12 hours to obtain epoxy resin-modified silicon carbide powder. In the second step, 20 parts of polyamide 12, 20 parts of amide 1212, 58 parts of modified silicon carbide, 0.5 parts of three (2,4-di-tert-butylphenyl) phosphite, 1.5 parts of tetrakis [β-( 3,5-di-tert-butyl-4-hydroxyphenyl)propionate]pentaerythritol ester was melt-mixed in a two-roll mill. The temperature of the two rollers is 170° C., the distance between the rollers is 0.5 mm, and the material is mixed between the ro...

Embodiment 2

[0029] In the first step, add 40 parts of aluminum nitride, 1 part of novolac epoxy resin F-51, 2 parts of novolac epoxy resin F-44, and 55 parts of methanol into the container, and stir for 2 hours under magnetic stirring at a speed of 500 rpm, then add 1 part of methyl hexahydrophthalic anhydride, 1 part of 1,4-butanediol glycidyl ether, continue to stir for 4 hours, then stir for 4 hours at 80 ° C, 200 rpm, the solvent evaporates, The obtained powder was dried in a vacuum oven at 50° C. for 24 hours to obtain epoxy resin-modified aluminum nitride powder. In the second step, 30 parts of polyamide 6, 35 parts of polyamide 66, 34 parts of modified aluminum nitride, 0.5 parts of 1,3,5-trimethyl-2,4,6-tri(3,5- Di-tert-butyl-4-hydroxybenzyl)benzene and 0.5 parts of β-(4-hydroxyphenyl-3,5-di-tert-butyl) n-octadecyl propionate were melt-mixed in a twin-screw extruder To make pellets, the melting temperature of the screw is 270°C, the rotation speed is 300 rpm, and the residence ti...

Embodiment 3

[0031] The first step, add 25 parts of magnesia and aluminum oxide (the two weight ratio can be any ratio, in the present embodiment is 1: 2), 0.5 part of bisphenol A type epoxy resin E-51, 74 parts in container Ethanol, stirred under magnetic stirring for 1.5 hours, the speed was 500 rpm, then added 0.15 parts of m-phenylenediamine, 0.1 parts of diaminodiphenylmethane, 0.25 parts of trimethylolpropane glycidyl ether, and continued to stir for 5 hours, then stirred at 40°C and 150 rpm for 4 hours, the solvent evaporated, and the obtained powder was dried in a vacuum oven at 40°C for 12 hours to obtain epoxy resin-modified magnesium oxide powder. In the second step, 45 parts of polyamide 66, 20 parts of modified magnesium oxide, 30 parts of modified aluminum oxide, 2.5 parts of 2,6-di-tert-butyl-4-methylphenol and 2.5 parts of phosphite tri (2,4-Di-tert-butylphenyl) ester is melted and mixed in a banbury mixer, the melting temperature of banbury is 280°C, the rotation speed of ...

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Abstract

The invention relates to a preparation method of a polyamide heat-conducting wear-proof composite. The method comprises the following steps: modifying heat-conducting wear-proof filler by using epoxy resin; and melting and mixing 40-65 parts of polyamide, 1-5 parts of antioxidant and 34-58 parts of the epoxy-coated heat-conducting wear-proof filler by weight, and cooling to obtain the polyamide heat-conducting wear-proof composite. According to the method, epoxy resin is used to coat the heat-conducting wear-proof filler and react with polyamide, thus the boundary problem of the inorganic filler and polyamide can be solved. As the selected inorganic filler has high heat conductivity and good insulativity and wear resistance, the final composite has insulating heat-conducting wear-proof property and can be used in fields such as heat exchangers, electronic packaging and mechanical manufacturing.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and relates to a preparation method of a polyamide-amine-based composite material, in particular to a preparation method of a polyamide heat-conducting and wear-resistant composite material. Background technique [0002] Polyamide (PA) has good comprehensive properties, including excellent mechanical properties, heat resistance, chemical resistance and self-lubrication, so it is used in automobiles, electrical equipment, mechanical parts, transportation equipment, textiles, paper machinery, etc. be widely used. However, the disadvantages of PA, such as low thermal conductivity, poor wear resistance, strong water absorption, and poor creep resistance, limit its wider application. [0003] In order to improve the deficiencies in the performance of PA, we use inorganic fillers to modify it. In addition to reducing costs, inorganic fillers can also increase or improve the properties of ...

Claims

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Application Information

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IPC IPC(8): C08L77/00C08L77/02C08L77/06C09K5/14C08K13/06C08K9/10C08K3/34C08K3/28C08K3/22
Inventor 胡新利戚嵘嵘陆佳琦罗宇
Owner 嘉兴高正新材料科技股份有限公司
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