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Low-silver-content solder alloy and solder paste composition

A technology of silver solder and composition, applied in welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of rising melting point, increased cost, poor connection, etc., to achieve good stretching, cost reduction, high The effect of fatigue resistance

Inactive Publication Date: 2012-07-11
HARIMA CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Ag contained in Sn-Ag-Cu-based alloys is expensive and increases the cost, thus constituting a major obstacle to the promotion of Sn-Ag-Cu-based alloys (lead-free solders)
[0009] Although it is possible to reduce the Ag content, the fatigue resistance (in particular, thermal fatigue resistance) deteriorates due to a small reduction in the Ag content, causing poor connection and the like
Attempts to further increase the strength of Sn-Ag-Cu-based alloys cause problems, namely, deteriorated elongation, increase in melting point, etc.

Method used

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  • Low-silver-content solder alloy and solder paste composition
  • Low-silver-content solder alloy and solder paste composition

Examples

Experimental program
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Effect test

Embodiment 1 to 9

[0071] The metal powders shown in Table 1 were each mixed in the proportions shown in Table 1. Low-silver solder alloys are each prepared by melting and homogenizing these metal mixtures in a furnace.

[0072] The low-silver solder alloys obtained in Examples 1 to 9 were each powdered by a well-known method (the particle diameter of these powders was 25-38 μm). Then, 88% by mass of each of the obtained solder powders and 12% by mass of a known flux were mixed together to obtain each solder paste composition.

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Abstract

This low-silver-content solder alloy comprises 0.05-2.0 mass% of silver, 1.0 mass% or less of copper, 3.0 mass% or less of antimony, 2.0 mass% or less of bismuth, 4.0 mass% or less of indium, 0.2 mass% or less of nickel, 0.1 mass% or less of germanium and 0.5 mass% or less of cobalt (wherein the content of each of the above-mentioned elements copper, antimony, bismuth, indium, nickel, germanium and cobalt is not 0 mass%), with the remainder being tin. According to the present invention, it becomes possible to provide a low-silver-content solder alloy which has a reduced Ag content and therefore can be produced at reduced cost, has excellent stretching properties, an excellent melting point, excellent strength and the like, and also has high fatigue resistance (cold thermal fatigue resistance) and long-lasting reliability.

Description

technical field [0001] The present invention relates to a low-silver solder alloy, in particular, to Sn-Ag-Cu (tin-silver-copper) used for solder bonding of circuit elements and the like to circuit substrates such as printed circuit substrates of electronic devices. ) are solder alloys and solder paste compositions. Background technique [0002] Generally, as a solder alloy used for metal bonding of electric or electronic devices, a solder alloy containing Pb (lead) (for example, a solder alloy containing 63% by mass Sn and 37% by mass Pb) is generally used. However, the impact of lead on the environment is a matter of concern. [0003] Recently, various lead-free solder alloys have been considered, such as Sn-Cu-based alloys, Sn-Ag-Cu-based alloys (Patent Documents 1-3), Sn-Bi (bismuth)-based alloys, Sn-Zn (zinc)-based alloy (Patent Document 4), each of which does not contain lead. [0004] Patent Document 1 discloses a solder ball in which one, two or more selected from...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/22C22C13/00C22C13/02B22F1/05
CPCB23K35/3006B23K35/262C22C13/00B22F1/0011C22C13/02B23K35/025C22C1/005B23K35/22B22F1/05C22C1/12
Inventor 今村阳司池田一辉朴锦玉竹本正
Owner HARIMA CHEM INC
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