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Polymer dielectric substance and preparation method thereof

A technology of dielectric materials and polymers, applied in the direction of fixed capacitor dielectrics and components of fixed capacitors, to achieve the effect of simple process, good processing performance and high dielectric constant

Inactive Publication Date: 2012-07-04
XIAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It can be seen that relying solely on metals, ferroelectric ceramics and carbon materials as fillers cannot make polymers obtain high dielectric constant-low loss and high thermal conductivity characteristics

Method used

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  • Polymer dielectric substance and preparation method thereof
  • Polymer dielectric substance and preparation method thereof
  • Polymer dielectric substance and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The main formula of the high dielectric constant-low dielectric loss polymer dielectric with good thermal conductivity involved in the present invention is as follows (weight ratio):

[0034] Polyvinylidene fluoride resin (PVDF) 36%

[0035] Composite structure aluminum particles (1-2μm) 60%

[0036] Carbon nanofiber (diameter: 100-200nm) 4%

[0037] A method for preparing a high dielectric constant-low dielectric loss polymer dielectric with such thermal conductivity, which is prepared by surface modification of carbon nanofibers, surface modification of composite structure aluminum particles, mixed fillers and polyvinylidene fluoride resin composite materials3 Partial composition:

[0038] (1) Surface modification of carbon nanofibers

[0039]Take 20g of carbon nanofibers, immerse in 40% hydrofluoric acid for about 24 hours for oxidation treatment, after immersion, filter to remove impurities, wash with deionized water about 10 times until the pH value is about 6. ...

Embodiment 2

[0045] Polyvinylidene fluoride resin (PVDF) 38%

[0046] Composite structure aluminum particles (1-2μm) 57.8%

[0047] Carbon nanofiber (diameter: 100-200nm) 4.2%

[0048] Preparation:

[0049] (1) Surface modification of carbon nanofibers

[0050] Take 20g of carbon nanofibers (diameter: 100-200nm), soak in hydrofluoric acid with a concentration of 40% for about 25h for oxidation treatment, after soaking, filter to remove impurities, wash with deionized water for about 8 times until the pH value is about 6. The carbon nanofibers from which impurities have been removed are placed in a vacuum oven and dried at 80° C. for about 28 hours, and are ready for use.

[0051] (2) Surface modification of aluminum particles with composite structure

[0052] Take about 100g of aluminum particles (1-2μm) into a 500ml three-neck flask, add 140ml of absolute ethanol, stir for 10 minutes, and then ultrasonicate the liquid mixture for 40 minutes. At the same time, weigh the silane coupli...

Embodiment 3

[0056] Polyvinylidene fluoride resin (PVDF) 40%

[0057] Composite structure aluminum particles (1-2μm) 55.5%

[0058] Carbon nanofiber (diameter: 100-200nm) 4.5%

[0059] Preparation:

[0060] (1) Surface modification of carbon nanofibers

[0061] Take 20g of carbon nanofibers (diameter: 100-200nm), soak in 40% hydrofluoric acid for about 26h oxidation treatment, after soaking, filter to remove impurities, wash with deionized water for about 12 times until the pH value is about 6. The carbon nanofibers from which impurities have been removed are placed in a vacuum oven and dried at 65° C. for about 32 hours, and are ready for use.

[0062] (2) Surface modification of aluminum particles with composite structure

[0063] Take about 100g of aluminum particles (1-2μm) into a 500ml three-neck flask, add 150ml of absolute ethanol, stir for 15 minutes, and then ultrasonicate the liquid mixture for 30 minutes. At the same time, weigh the silane coupling agent accounting for 1.5...

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Abstract

The invention relates to a formula of polymer dielectric substance with good heat conductivity, high dielectric coefficient and low dielectric loss and a preparation process of the formula, belonging to the crossed field of an electric engineering material and the chemical product manufacturing technique. The polymer dielectric substance is prepared from polyvinylidene fluorine, carbon nanofibers with modified surface, and micron composite structure aluminum particles with ultrafine particle size through the procedures of dissolving, mixing, agitating, ultrasonically processing, high-speed dispersing, separating, drying, baking, laminating and hot-pressing. According to high heat conductivity of the novel polymer dielectric substance prepared by the invention, the thermal breakdown voltage of the dielectric medium is improved and the service life of the dielectric medium is also prolonged. The dielectric substance has the advantages of simpler preparation technique and better processing property. The material prepared by the invention is mainly used for preparing an embedded non-coupling capacitor, a chip multi-layer organic film capacitor, a high-energy storage capacitor element and the like. The polymer dielectric substance is widely applied to circuit devices of devices such as a high-frequency communication device, an LED illumination device, an automotive electronics device, a computer, a switch power supply and the like.

Description

Technical field: [0001] The invention relates to a preparation process of a high dielectric constant and low loss polymer dielectric material with good thermal conductivity. The report of the present invention relates to the cross-research field between high dielectric constant and low dielectric loss polymer dielectric and heat-conducting and insulating polymer dielectric, and belongs to the cross-manufacturing field of electrical materials and chemical industry. Background technique: [0002] In any practical dielectric material, the field strength is high or low, and there is always a loss current passing through it. The loss current will increase the temperature of the medium, which in turn will further increase the loss. In this way, due to the low thermal conductivity of the medium itself, when the heat accumulated inside cannot be effectively dissipated quickly, the temperature of the dielectric will continue to rise, further causing its material to decompose, carboni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/16C08K13/04C08K7/06C08K3/08C08K3/04H01G4/14
Inventor 周文英
Owner XIAN UNIV OF SCI & TECH
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