Cooling device for diamond-wire cutting system

Abstract

A cooling device for a diamond-wire cutting system includes a fluid retarding space as a cooling tank enclosed and defined by one or more surfaces for temporarily holding a cooling fluid. The surfaces provide a closed or semi-open sidewall that allows a cutting part of a diamond wire for cutting a workpiece to pass through the cooling tank and get immersed in the cooling fluid. A sorting collector is connected to the cooling tank. Thereby, cutting the hard-brittle workpiece is always performed in the cooling fluid, so as to prevent the cooling fluid and cutting chips from splashing, and improve heat dissipation and dust removal, thereby enhancing the cutting capability and efficiency. The tooled workpiece has cut surfaces with improved smoothness. The sorting collector performs solid-liquid separation to the cooling fluid containing cutting chips, so that the cutting chips and the cooling fluid can be recycled.

Description

technical field [0001] The present invention relates to a cooling device for cutting hard and brittle materials with a diamond wire. That is to say, the cutting part is completely immersed in a liquid tank filled with cooling liquid, so as to further enhance the cutting ability and efficiency, and damage the wire saw. It has a significant reduction effect and can improve the roughness of the processed surface of hard and brittle materials, while preventing the coolant and chips from splashing around, and the ease of concentration or recovery of cutting chips. Background technique [0002] Generally hard and brittle materials (for example: single polysilicon crystal rod cutting, gallium arsenide crystal rod cutting, glass quartz crystal rod cutting, and other hard and brittle materials) are cut because the hard and brittle materials have high hardness and poor conductivity. Good, brittle and other characteristics, causing some difficulties in processing, for example: in the s...

AI Technical Summary

Problems solved by technology

[0004] However, the diamond wire 1 will come into contact with the cooling liquid and be rinsed and cooled only at the place where the hard and brittle material is sawed. There is air in the sawing place that cannot be discharged, so that the coolant cannot enter, so the cooling effect of the diamond wire 1 is really limited, which will affect the cutting ability, cutting speed, and roughness of the processed surface of the diamond wire 1.

[0005] Furthermore, when the diamond wire 1 cuts the workpiece at high speed, chips and dust will be generated because the workpiece is a hard and brittle material. The diamond line 1 traveling at high speed generates impulses, causing the coolant to splash around, and the generated debris and coolant are not easy to concentrate and recover.

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