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Metal insulation chip test needle frame

A technology of chip testing and metal insulation, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problems that the coaxial controllable reactance chip test needle frame is not widely used, and the assembly and disassembly are inconvenient, etc., to achieve The effect of improving electrical performance and avoiding short circuit

Inactive Publication Date: 2012-06-27
ANTARES ADVANCED TEST TECH SUZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual production process, since the spring probe itself is very small, it is very inconvenient to use a sleeve slightly larger than the spring probe, whether it is processing, assembly or disassembly, and it can only be used in hole spacing. In the case of more than 1 mm, such a coaxial controllable reactance chip test needle holder is often not widely used

Method used

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  • Metal insulation chip test needle frame
  • Metal insulation chip test needle frame
  • Metal insulation chip test needle frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1, such as figure 1 As shown, a metal-insulated chip test needle frame, the bottom is a probe holding plate 4 made of metal, and a spring probe 6 is inserted into the probe holding plate 4 . The ground copper block 3 is connected with the probe holding plate 4 , and the probe / chip positioning plate 1 made of metal is connected with the ground copper block 3 . The spring probe 6 is fixed on the probe holding plate 4 and put into the hole of the probe / chip positioning plate 1, and the upper end of the spring probe 6 is in contact with the chip to be tested. Through the metal aluminum oxidation process and Teflon spraying process, an insulating coating is formed on the inner wall and side of the probe holding plate 4 and the probe / chip positioning plate 1. The insulating coating is composed of aluminum oxide and Teflon. The thickness of the aluminum layer is 0.04 mm, and the thickness of the Teflon layer is 0.002 mm. At this time, the ratio of the inner diameter ...

Embodiment 2

[0019] Example 2. If figure 2 with image 3 As shown, a metal-insulated chip test needle holder, the bottom is a probe holding plate 4 made of metal, and one end of a spring probe 6 is inserted into the probe holding plate 4 . Connected to the probe holding plate 4 is a metal probe / chip positioning plate 1 (see figure 2 ), or the needle holder body 2 made of metal (see image 3 ). The other end of the spring probe 6 is placed into the hole of the probe / chip positioning plate 1, and its upper end is in contact with the chip to be tested. Through metal aluminum oxidation process and Teflon spraying process, aluminum oxide and Teflon insulating coating are formed on the inner wall and side of probe holding plate 4, probe / chip positioning plate 1 (or needle frame main body 2). The layer is composed of alumina and Teflon, the thickness of the alumina layer is 0.02 mm, and the thickness of the Teflon layer is 0.001 mm. After having this insulating coating, the inner insulatio...

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Abstract

A metal insulation chip test needle frame relates to chip test equipment in a semiconductor and electronic connector industry. The needle frame comprises: a probe / chip location plate which is made of a metal material, a needle frame body, a probe maintenance plate and spring probes inserted into the probe maintenance plate, wherein the probe / chip location plate which is made of a metal material, the needle frame body, the probe maintenance plate and the spring probes inserted into the probe maintenance plate are mutually connected. An inner wall and a side surface which are formed by the probe / chip location plate, the needle frame body and the probe maintenance plate are insulating coatings. The insulating coating comprises: an aluminum-oxide layer formed by using a metallic aluminum oxidation technology and a Teflon layer formed by using a Teflon coating technology. The insulating coating can be used in a controllable reactance chip test needle frame with a coaxial structure. By using the chip test needle frame which adopts the insulating coatings, intensity can be substantially increased. When a number of the spring probes exceed 1500, the chip test needle frame can still work normally. Simultaneously, the reactance of the test needle frame from a top to a bottom maintains a constant value so that an electrical property of the test needle frame can be increased. The needle frame can be used in occasions with a chip operation speed which is above 30 megahertz.

Description

technical field [0001] The invention relates to the industry of semiconductors and electronic connectors, in particular to a chip testing device. Background technique [0002] In the semiconductor and electronic connector industry, no matter in the research and development stage or in the production stage, it is necessary to conduct electrical tests on semiconductor chips to check whether the chips meet the requirements of electrical performance. The chip test needle holder is an indispensable test device in the whole test system. The chip test needle holder consists of a probe / chip positioning plate made of plastic, a needle holder body, spring probes, and a probe holding plate. [0003] In recent years, as the core computing speed of the chip is getting faster and faster, correspondingly, it is also required that the chip test needle holder can meet the requirements of the high-frequency test environment. A controllable reactance chip test probe holder with coaxial struc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067
Inventor 周家春刘德先陶西昂洪步郎
Owner ANTARES ADVANCED TEST TECH SUZHOU CO LTD
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