Lead-free low expansion coefficient glass powder for TFT-LCD sealing and preparation method thereof

Abstract

The invention discloses lead-free low expansion coefficient glass powder for TFT-LCD sealing and a preparation method thereof. The lead-free low expansion coefficient glass for TFT-LCD sealing comprises 85-95 wt% of base glass and 5-15 wt% of filling materials, wherein the filling materials comprises beta-eucryptite microcrystalline glass having the expansion coefficient of -8.4*10<-7> / DEG C--6.2*10<-7> / DEG C. The glass contains no lead and is green and environmentally friendly, can be used for replacing leaded glass to eliminate the lead pollution to the environment, and has the advantages of excellent chemical stability, simple preparation technology, and low cost. Compared with other lead-free sealing glass powder, under the glass transition temperature of 440-480 DEG C, the softening temperature of 480-510 DEG C and the sealing temperature of lower than 600 DEG C, the glass powder disclosed herein has lower expansion coefficient which can be adjustable in a range of (40-60)*10<-7> / DEG C, and can satisfy the sealing requirements of TFT-LCD film transistor LCDs.

Description

technical field [0001] The invention belongs to the field of sealing glass powder and a preparation method thereof, in particular to a lead-free low expansion coefficient glass powder for TFT-LCD sealing and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of flat panel display technology, it has gradually replaced the traditional CRT (Cathode Ray Tube, cathode ray tube) display products, and TFT-LCD (Thin Film Transistor Liquid Crystal Display, thin film transistor liquid crystal display) is currently Among the mainstream flat panel display products on the market, TFT-LCD substrate glass (hereinafter referred to as substrate glass) is an important part of TFT-LCD and has become one of the key raw materials restricting the development of TFT-LCD. Each TFT-LCD panel consists of two It is composed of a substrate glass, which is used as a thin film transistor array substrate and a color filter substrate respectively. The s...

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Problems solved by technology

The softening temperature of the glass system is 395-408°C, the sealing temperature is lower than 490°C, and the thermal expansion coefficient can be reduced to (68-78)×10 by adding fillers. -7 / °C, but the filling ratio of the glass system is as high as 20%, and the glass fluidity and chemical stability are poor during the sealing process

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