Copper/aluminum ultrasonic liquid-phase diffusion brazing process and brazing device

A liquid phase diffusion and brazing process technology, applied in metal processing, manufacturing tools, welding equipment, etc., can solve problems such as difficulty in ultrasonic brazing, and achieve the effects of simple structure, strong controllability and simple operation process

Inactive Publication Date: 2014-01-22
SHANDONG JIANZHU UNIV
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Problems solved by technology

Its disadvantage is that this method needs to use flux in the brazing process, which has higher requirements on the surface state and structure of copper / aluminum joints. For joints with complex structures, such as aluminum wire and copper wire commonly used in the electrical and electronic industry The joint structure of the lead-out end (the copper terminal half surrounds the aluminum wire), its ultrasonic brazing is more difficult

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  • Copper/aluminum ultrasonic liquid-phase diffusion brazing process and brazing device

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Embodiment Construction

[0015] In order to clearly illustrate the technical features of the solution, the solution will be described below through a specific implementation manner.

[0016] As shown in the accompanying drawing, an ultrasonic liquid phase diffusion brazing process for copper / aluminum joints specifically includes the following steps, a: prepare a crucible, install an ultrasonic generator at the bottom of the crucible, the ultrasonic generator is located outside the crucible, and An argon air curtain is installed directly above the crucible, and a heating device is arranged on the periphery of the crucible, and the heating device has a control panel;

[0017] b: Adjust the ultrasonic generator control panel so that the frequency is 20KHz and the power density is 0.3-0.5W / mm 2 Ultrasonic; adjust the control panel of the heating device to make the temperature of the solder reach 320-380°C and keep it;

[0018] c: Open the argon air curtain, make the flow rate of argon be 5L / min and lead ...

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Abstract

The invention discloses a copper / aluminum ultrasonic liquid-phase diffusion brazing process and a brazing device. The brazing process adopts the technical scheme that the copper / aluminum ultrasonic liquid-phase diffusion brazing process adopts Sn-9Zn eutectic alloy brazing filler metal, and does not adopt brazing flux; the brazing temperature is low; and the requirements on the surface and the structure of a copper / aluminum brazing connector are not high. The brazing process has the beneficial effects that the brazing process is accomplished in brazing filler metal at a molten state, and the problem of heat preservation of the brazing filler metal during the brazing is eliminated; the controllability of brazing technological parameters is high, the operation process is simple, and the efficiency is high; the copper / aluminum connector adopting the brazing process is smooth, and the performances of the copper / aluminum connector are remarkably improved; and the anti-corrosion capability and both the high and low temperature impact resistance of the copper / aluminum brazing connector meet the requirements of national relevant standards.

Description

technical field [0001] The invention relates to a brazing process and a brazing device, in particular to a copper / aluminum ultrasonic liquid phase diffusion brazing process. Background technique [0002] The patent (US 7 624 906 B2. Dec.1, 2009) discloses a copper / aluminum brazing method. The method is to apply ultrasonic waves to the base material, and transmit the ultrasonic energy to the joint placed on the joint to be welded through the base material. The molten solder at one end makes the solder quickly fill the brazing seam to realize the brazing process. Its disadvantage is that this method needs to use flux in the brazing process, which has higher requirements on the surface state and structure of copper / aluminum joints. For joints with complex structures, such as aluminum wire and copper wire commonly used in the electrical and electronic industry The joint structure of the lead-out end (the copper terminal is half-surrounded by the aluminum wire), and its ultrason...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/06B23K3/00B23K3/08
Inventor 孙德明杨刘波刘鹏李阳王献忠张保议王志刚
Owner SHANDONG JIANZHU UNIV
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