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Manufacturing method of aluminum-based cover plate for drilling

A cover plate and aluminum-based technology, which is applied in drilling/drilling equipment, chemical instruments and methods, parts of boring machines/drilling machines, etc., can solve problems such as shrinkage, cracking, and stickiness of the coating surface, and reduce viscosity , Improve the adhesion and solve the effect of uneven coating surface

Active Publication Date: 2012-06-20
烟台柳鑫新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a new method for preparing an aluminum-based cover plate for drilling in view of the above-mentioned defects in the prior art. The aluminum-based cover plate prepared by the method of the present invention can not only improve the positioning accuracy of the hole, but also Solve problems such as stickiness, cracking, and shrinkage cavity on the coating surface, and the lubricating coating composition of the cover plate is the same type of polymer material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Weigh 34 parts by weight of hexamethylene diisocyanate, 100 parts by weight of polybutylene adipate diol (the number average molecular weight is 1000), 0.1 parts by weight of dibutyltin laurate, 50 parts by weight of dimethyl The components of formamide reacted in the reactor for 3 hours; then added 12 parts by weight of ethylene glycol and 17 parts by weight of hexamethylene diisocyanate to continue the reaction for 3 hours, then added 113 parts by weight of dimethylformamide, Prepare the first polyurethane solution with a mass percentage of 50% polyurethane; (2) weigh 34 parts by weight of hexamethylene diisocyanate, 400 parts by weight of polyethylene glycol (number average molecular weight is 4000), 0.1 parts by weight The components of zinc octoate and 300 parts by weight of dimethylformamide reacted in the reactor for 4 hours; then added 24 parts by weight of ethylene glycol and 51 parts by weight of hexamethylene diisocyanate to continue the reaction for 4 hou...

Embodiment 2

[0028] (1) Weigh 44 parts by weight of isophorone diisocyanate, 200 parts by weight of polyethylene adipate diol (number average molecular weight is 2000), 0.12 parts by weight of zinc octoate, 100 parts by weight of dimethyl formaldehyde The components of the amide reacted in the reactor for 3 hours; then added 18 parts by weight of 1,4-butanediol and 22 parts by weight of isophorone diisocyanate to continue the reaction for 3 hours, and then added 184 parts by weight of dimethyl Acetamide, prepared into the first polyurethane solution with a mass percentage of 50% polyurethane; (2) Weighing 44 parts by weight of isophorone diisocyanate, 1800 parts by weight of polyethylene glycol (the number average molecular weight is 18000), The components of 0.13 parts by weight of dibutyltin laurate and 1000 parts by weight of dimethylacetamide were reacted in the reactor for 4 hours; the isophorone diisocyanate of 24 parts by weight and 66 parts by weight of isophorone diisocyanate were ...

Embodiment 3

[0031] (1) Weigh 50 parts by weight of diphenylmethane diisocyanate, 300 parts by weight of polypropylene glycol (the number average molecular weight is 3000), 0.15 parts by weight of zinc octoate, and 150 parts by weight of ethyl acetate, and react in the reactor for 3 hour; Add 24 parts by weight of N-methyldiethanolamine and diphenylmethane diisocyanate of 25 parts by weight to continue the reaction for 3 hours, then add 249 parts by weight of ethyl acetate to prepare the first polyurethane mass percentage of 50% polyurethane solution; (2) Weigh 50 parts by weight of diphenylmethane diisocyanate, 3500 parts by weight of polyethylene oxide (the number average molecular weight is 35000), 0.13 parts by weight of dibutyltin laurate, 2000 parts by weight of ethyl acetate The components of the ester reacted in the reactor for 4 hours; then added 54 parts by weight of dimethylol propionic acid and 75 parts by weight of diphenylmethane diisocyanate to continue the reaction for 4 hou...

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Abstract

The invention discloses a manufacturing method of an aluminum-based cover plate for drilling of a printed circuit board. The manufacturing method comprises the steps of: reacting the following constituents in a certain part by weight: diisocyanate, polyester diol or polyether diol (I), a catalyst and a solvent, adding a chain extender and the diisocyanate for continuous reaction, and adding the solvent to obtain a first polyurethane solution; in addition, reacting the following constituents in a certain part by weight: the diisocyanate, polyester diol or polyether diol (II), the catalyst and the solvent, adding the chain extender and the diisocyanate for continuous reaction, and adding the solvent to obtain a second polyurethane solution; then uniformly mixing the two polyurethane solutions, adding the solvent to prepare a polyurethane solution with a certain concentration, standing and de-foaming; and coating the obtained polyurethane solution onto the upper surface of an aluminum foil, drying and cooling to obtain the aluminum-based cover plate. The aluminum-based cover plate manufactured by the manufacturing method disclosed by the invention is capable of improving the location accuracy of holes and reducing the section drilling rate, and is favorable for solving the problems on uneven coating surface, shrinkage cavity, pastiness and the like.

Description

technical field [0001] The invention belongs to the technical field of preparation of special materials, and in particular relates to a method for preparing an aluminum-based cover plate for drilling, which is mainly used for drilling printed circuit board materials. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The development of printed circuit boards has a history of more than 100 years. The main advantage of using printed circuit boards is to greatly reduce the errors of wiring and assembly, and improve the level of automation and production labor rate. The production of printed circuit boards is based on insulating boards, cut to a certain size, with at least one conductive pattern attached to it, and holes (such as component holes, fastening holes, metallized holes, etc.) Install the chassis of electronic components and realize the interconnection between ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/095B32B37/08C08G18/66C08G18/48C08G18/42C08G18/34C08G18/32B23B47/00
Inventor 周虎杨柳罗小阳唐甲林秦先志郭家旺
Owner 烟台柳鑫新材料科技有限公司
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