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Electrode substrate and manufacturing method thereof

A technology for electrode substrates and manufacturing methods, which is applied in the direction of electrical digital data processing, conductive layers on insulating carriers, instruments, etc., can solve problems such as unusable substrates, many man-hours, and increased manufacturing costs of electrode substrates, and achieve reduction in heating processes, Reduced man-hours and cost reduction effects

Inactive Publication Date: 2012-04-18
ALPS ALPINE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, since the photolithography process and the etching process require many man-hours, the manufacturing cost of the electrode substrate increases.
In addition, since there are many heating steps, the materials used are limited, and the material of the substrate is also limited to glass, etc., so it is not possible to use synthetic resin substrates, etc.

Method used

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  • Electrode substrate and manufacturing method thereof
  • Electrode substrate and manufacturing method thereof
  • Electrode substrate and manufacturing method thereof

Examples

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Embodiment Construction

[0069] figure 1 The shown capacitive detection device 1 includes an electrode substrate 10 according to an embodiment of the present invention. The electrode substrate 10 has a substrate 11 formed of a light-transmitting synthetic resin film such as PET (polyethylene terephthalate). 3a engagement. The adhesive layer 2 is formed of a light-transmitting adhesive such as acrylic. The operation panel 3 is formed of a translucent synthetic resin plate such as polycarbonate, a translucent glass plate, or the like.

[0070] In this specification, light transmittance means that the overall light transmittance is 60% or more, preferably 80% or more.

[0071] figure 1 The detection device 1 shown is arranged in front of a self-luminous display device such as a liquid crystal display device equipped with a backlight, and the display content of the display device can be visually observed through the detection device 1 .

[0072] The front surface of the operation panel 3 of the detec...

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Abstract

The invention provides an electrode substrate of a connecting conductive layer which can connects adjacent electrode layers in a tiny width size and the manufacturing method of the electrode substrate. An electrode forming face (11a) of a substrate (11) is provided with a liquid resin (25) in an ink-jet dotted mode. The dot density of the liquid resin changes according to different places. After the supplied liquid resin fuses, a concave part (22a) can be formed between convex parts (21a, 21a) and the convex parts (21a, 21a) according to the viscosity and the surface tension of the liquid resin. Before the shape elimination of the convex parts (21a, 21a) and the concave part (22a), a liquid resin layer (25a) is carried out the UV irradiation, so the resin is hardened, and a groove part between cofferdam bodies is formed, and the connecting conductive layer connecting the electrode layers is formed in the groove part.

Description

[0001] technology area [0002] The present invention relates to an electrode substrate having an electrode layer formed on the surface used in a detection device for detecting changes in electrostatic capacitance, or other detection devices, or a display device, and in particular relates to an electrode substrate provided between adjacent first electrode layers. A second electrode layer, an electrode substrate with a structure of connecting the first electrode layers to each other across the second electrode layer, and a manufacturing method thereof. Background technique [0003] Conventional electrode substrates used in detection devices or display devices have a structure in which electrode layer patterns are separated on the front and back surfaces of the substrate, or a structure in which an insulating layer is interposed between a plurality of electrode layer patterns. Recently, in order to realize thinning of devices, electrode substrates in which patterns of various el...

Claims

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Application Information

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IPC IPC(8): G06F3/044G06F3/041
CPCG06F2203/04103G06F3/0443H01B5/14
Inventor 尾崎恭辅渡部弘也上野毅
Owner ALPS ALPINE CO LTD
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