Heat treatment method of porous copper-aluminum-manganese shape memory alloy

A heat treatment method and memory alloy technology, which is applied in the field of heat treatment of porous copper-aluminum-manganese shape memory alloys, can solve the problems of copper-based shape memory alloys such as the decline in damping performance, achieve good comprehensive performance, and improve the effect of comprehensive performance

Inactive Publication Date: 2013-07-10
HEBEI UNIV OF TECH
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical operation, the damping capacity of copper-based shape memory alloys is still related to many factors, such as the concentration of quenching vacancies, the shape, size and orientation of martensitic variants, and the large number of quenching vacancies introduced during the quenching process are subject to long-term aging at room temperature. During the process, it will gradually migrate to the martensite interface or dislocation, and cause the martensite stabilization effect, resulting in a decrease in the damping performance of the copper-based shape memory alloy

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat treatment method of porous copper-aluminum-manganese shape memory alloy
  • Heat treatment method of porous copper-aluminum-manganese shape memory alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The first step, solution treatment of porous copper-aluminum-manganese shape memory alloy

[0043] The porous copper-aluminum-manganese shape memory alloy prepared by sintering-desolventization process is placed in a tubular vacuum / atmosphere furnace, and high-purity argon is firstly circulated at a large flow rate for 5 minutes to expel the furnace tube and porous copper-aluminum-manganese shape memory After that, the air in the alloy cells starts to heat up, and at the same time, the high-purity argon flow rate is reduced, and the heat preservation is carried out after the temperature rises to 850°C, so as to ensure that the porous copper-aluminum-manganese shape memory alloy prepared by the sintering-desolventization process is The solid solution time of mm effective thickness is 500 seconds;

[0044] The second step, quenching treatment of porous copper-aluminum-manganese shape memory alloy

[0045] After the solid solution treatment of the porous copper-aluminum-m...

Embodiment 2

[0052] The first step, solution treatment of porous copper-aluminum-manganese shape memory alloy

[0053] The porous copper-aluminum-manganese shape memory alloy prepared by sintering-desolventization process is placed in a tubular vacuum / atmosphere furnace, and high-purity argon is firstly circulated at a large flow rate for 5 minutes to expel the furnace tube and porous copper-aluminum-manganese shape memory The air in the alloy cells starts to heat up, and at the same time, the flow rate of high-purity argon gas is reduced, and the heat preservation is carried out after the temperature rises to 870°C, so as to ensure that the porous copper-aluminum-manganese shape memory alloy prepared by the sintering-desolventization process is The solid solution time of mm effective thickness is 480 seconds;

[0054] The second step, quenching treatment of porous copper-aluminum-manganese shape memory alloy

[0055] After the solid solution treatment of the porous copper-aluminum-mangan...

Embodiment 3

[0061] The first step, solution treatment of porous copper-aluminum-manganese shape memory alloy

[0062] The porous copper-aluminum-manganese shape memory alloy prepared by sintering-desolventization process is placed in a tubular vacuum / atmosphere furnace, and high-purity argon is firstly circulated at a large flow rate for 5 minutes to expel the furnace tube and porous copper-aluminum-manganese shape memory After that, the air in the alloy cells starts to heat up, and at the same time, the high-purity argon flow rate is reduced, and the heat preservation is carried out after the temperature rises to 900°C, so as to ensure that the porous copper-aluminum-manganese shape memory alloy prepared by the sintering-desolventization process is The solid solution time of mm effective thickness is 450 seconds;

[0063] The second step, quenching treatment of porous copper-aluminum-manganese shape memory alloy

[0064] After the solid solution treatment of the porous copper-aluminum-m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a heat treatment method of a porous copper-aluminum-manganese shape memory alloy, and relates to the heat treatment of a porous shape memory alloy. The method comprises the steps of: carrying out solid solution treatment on the porous copper-aluminum-manganese shape memory alloy, which is prepared by adopting a sintering-desolventing process, at the solid solution temperature of 850-900 DEG C for the solid solution time of 450-500 seconds, wherein the solid solution time can guarantee that the effective thickness per millimeter of the porous copper-aluminum-manganese shape memory alloy is subjected to solid solution treatment; quenching in quenching oil at 60-80 DEG C; carrying out aging heat treatment at the aging heat treatment temperature of 340-360 DEG C for the aging time of 100-120 seconds, wherein the aging time can guarantee that the effective thickness per millimeter of the porous copper-aluminum-manganese shape memory alloy is subjected to aging; andfinally drying at 80 DEG C. By using the heat treatment method, the damping property of the porous copper-based shape memory alloy, which is prepared by using the sintering-desolventing method, is improved and stabilized; and the method can better adapt to the demand of practical application.

Description

technical field [0001] The technical solution of the invention relates to the heat treatment of porous shape memory alloys, in particular to a heat treatment method of porous copper aluminum manganese shape memory alloys. Background technique [0002] With the development of industrial civilization, mechanical equipment tends to be high-speed, efficient and automated. The resulting vibration, noise and fatigue fracture problems are becoming more and more prominent. Vibration and noise can cause electronic devices to fail, shorten the life of mechanical parts, cause human fatigue and illness, and reduce the efficiency of workpieces. Therefore, reducing vibration and noise and improving the man-machine environment are problems to be solved urgently. Damping technology is the most effective way to control structural resonance and noise. High damping materials are materials with high shock and noise reduction capabilities. It is of great significance to study the damping beh...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C22F1/08C22F1/02C22C1/08
Inventor 王清周陆东梅崔春翔闫娜君王倩李诺
Owner HEBEI UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products