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Pulse electrochemical deposition and tissue adjustment processes for nickel plating copper belt

A nickel-plated copper, electrochemical technology, applied in the field of pulsed electrochemical deposition and tissue adjustment process, can solve the problem of unfavorable bending resistance and corrosion resistance of nickel-plated nickel-plated copper strip, unable to meet the requirements of high-performance electronic products, plating The problem of unfavorable bending resistance of nickel-copper strips can achieve the effect of improving comprehensive mechanical properties and physical properties, uniform and fine grain structure, and reducing the probability of hydrogen embrittlement.

Inactive Publication Date: 2012-01-25
CHANGSHA STORM ENERGY TTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A typical example is a pure copper strip with excellent bending resistance (180° bending, > 12 times without breaking), after the nickel plating process, the bending resistance is greatly reduced (180° bending, < 4 times without breaking)
Moreover, due to the uneven thickness of the conventional DC electroplating nickel due to the uneven current distribution, the thickness of the electroplating layer varies greatly on the entire copper strip. Thin coating on inner surface or away from anode
The unevenness of the nickel coating will also have an adverse effect on the bending resistance and corrosion resistance of the nickel-plated copper strip
At the same time, during the nickel electroplating process, the nickel grains are accumulated vertically to the surface of the copper strip, regardless of the grain orientation or the bonding strength between grains, it is unfavorable to the bending resistance of the nickel-plated copper strip.
[0004] The domestic nickel-plated copper strip preparation technology mainly achieves the purpose of improving the bending resistance through the subsequent annealing and post-treatment process of electroplating nickel, but at present, the highest can only achieve 180°, 3 to 4 times of bending without breaking, which cannot meet high performance. Electronic Product Requirements

Method used

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  • Pulse electrochemical deposition and tissue adjustment processes for nickel plating copper belt
  • Pulse electrochemical deposition and tissue adjustment processes for nickel plating copper belt

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] a) Degreasing the surface of the copper strip: In the lye at a temperature of 50°C, use ultrasonic waves to clean the grease on the surface of the copper strip, then clean it with deionized water and dry it;

[0023] b) Remove the oxide layer on the surface of the copper strip: In a medium-temperature acid solution, the temperature of the acid solution is 40°C, use ultrasonic waves to clean the oxide layer on the surface of the copper strip, then clean it with deionized water and absolute alcohol, and dry it;

[0024] c) Pulse nickel plating: based on Watt’s nickel plating solution, nickel plating is achieved with pulse current, pulse current density J p =30mA / cm 2 , average current density J m =30mA / cm 2 , power-on time range T on 3 ms, power down time range T off 7 milliseconds, change the pulse current application time, the application time is: 5 to 30 minutes;

[0025] d) Vacuum heat treatment: heating the nickel-plated copper strip obtained in step c to 200°C ...

Embodiment 2

[0029] a) Degreasing the surface of the copper strip: In the lye at a temperature of 60°C, use ultrasonic waves to clean the grease on the surface of the copper strip, then clean it with deionized water and dry it;

[0030] b) Remove the oxide layer on the surface of the copper strip: In a medium-temperature acid solution, the temperature of the acid solution is 50°C, use ultrasonic waves to clean the oxide layer on the surface of the copper strip, then clean it with deionized water and absolute alcohol, and dry it;

[0031] c) Pulse nickel plating: based on Watt’s nickel plating solution, nickel plating is achieved with pulse current, pulse current density J p =30mA / cm 2 , average current density J m =30mA / cm 2 , power-on time range T on 3 ms, power down time range T off 7 milliseconds, change the pulse current application time, the application time is: 5 to 30 minutes, control the thickness of the nickel layer;

[0032] d) Vacuum heat treatment: heating the nickel-plate...

Embodiment 3

[0036] a) Degreasing the surface of the copper strip: In the alkali solution at a temperature of 80°C, use ultrasonic waves to clean the grease on the surface of the copper strip, then clean it with deionized water and dry it;

[0037] b) Remove the oxide layer on the surface of the copper strip: In a medium-temperature acid solution, the temperature of the acid solution is 60°C, use ultrasonic waves to clean the oxide layer on the surface of the copper strip, then clean it with deionized water and absolute alcohol, and dry it;

[0038] c) Pulse nickel plating: based on Watt’s nickel plating solution, nickel plating is achieved with pulse current, pulse current density J p =30mA / cm 2 , average current density J m =30mA / cm 2 , power-on time range T on 3 ms, power down time range T off 7 milliseconds, change the pulse current application time, the application time is: 5 to 30 minutes, control the thickness of the nickel layer;

[0039] d) Vacuum heat treatment: heating the ...

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Abstract

The invention discloses pulse electrochemical deposition and tissue adjustment processes for a nickel plating copper belt. The process comprises the following steps of: performing pulse plating on a nickel coating; performing subsequent cold machining deformation and vacuum heat treatment processes, and the like. By the pulse electrochemical deposition process, the thickness of the nickel coating deposited on the copper belt and the uniformity of a microscopic structure can be effectively ensured; and by the subsequent cold machining deformation and vacuum heat treatment processes, the comprehensive mechanical property, particularly the bending resistance and the physical property of the nickel plating copper belt can be improved, so that high-quality nickel plating copper belts required in industries such as electronics, batteries, electrovacuum, electric light sources and the like can be possibly processed. The pulse nickel plating and tissue adjustment process is low in required equipment investment, has a simple method, is convenient to operate and is suitable for industrial production.

Description

technical field [0001] The invention relates to a pulse electrochemical deposition and structure adjustment process of a nickel-plated copper strip, belonging to the technical field of pulse electroplating process. Background technique [0002] Nickel-plated copper strips are widely used in precision electronics, connectors of relay switches, conductive connectors of digital electronic products, conductive connectors of high-power battery packs, etc. In addition to excellent electrical conductivity, sufficiently thin thickness, good corrosion resistance and weldability, the nickel-plated copper strip also requires extremely high bending resistance: 180° bending, more than 8 times without breaking. At present, the nickel-plated copper strips produced by only one or two companies in the world can basically meet the performance requirements. [0003] The bending resistance of nickel-plated copper strip is directly related to the purity of nickel coating (hydrogen or other impu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/00C25D5/34C25D5/18C25D5/50
Inventor 韦伟峰胡许先
Owner CHANGSHA STORM ENERGY TTECH
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