60-watt loading sheet of aluminium nitride ceramic substrate with 50 omegas of impedance

Abstract

The invention discloses a 60-watt loading sheet of an aluminium nitride ceramic substrate with 50 omegas of an impedance. The loading sheet comprises an aluminium nitride substrate with a square area of 4 * 4* 1 millimeters. A back guiding layer is printed on a back side of the aluminium nitride substrate as well as a resistance and a lead are printed on a right side of the aluminium nitride substrate. The lead is connected with the resistance to form a loading circuit. An earth terminal of the loading terminal is electrically connected with the back guiding layer. And a glass protection film is printed on the resistance. According to the 60-watt loading sheet of the aluminium nitride ceramic substrate with 50 omegas of the impedance, the structure of the 60-watt loading sheet is developed from a design of a 50-watt loading sheet; an earth terminal is arranged at a side of a bonding pad instead of the opposite side, so that more space is left and an area of the resistance is increased; a power is improved by 20% on a same-size substrate; compared with same-power aluminium nitride loading sheet, a general size of the loading sheet provided in the invention is reduced by almost one third; meanwhile, the loading sheet has good VSWR performance and a market demand is met. On the condition that a production size and a production specification of a loading sheet of a current aluminium nitride ceramic substrate are centralized without any change, more emphasis is put on a market orientation according to the loading sheet provided in the invention; connection between different powers of different aluminium nitride products is realized on the basis of different designs and various selection is provided for a client; therefore, the loading sheet provided in the reflects a high cost performance and an advantage of product diversification.

Description

technical field [0001] The invention relates to a loading sheet of an aluminum nitride ceramic substrate, in particular to a 60-watt loading sheet of an aluminum nitride ceramic substrate with an impedance of 50Ω. Background technique [0002] Aluminum nitride ceramic substrate load sheets are mainly used to absorb the reverse input power of communication components in communication base stations. Previously, low-power products used alumina ceramics as substrates, and high-power products used beryllium oxide ceramics as substrates. Nitrogen The high-power load chip of aluminum ceramic substrate is an emerging industry, so there is a relatively concentrated phenomenon of load chip size and specification at home and abroad, and there is no customer-oriented diversified production, which leads to the general use of higher specification grades in the market to replace higher For low specification requirements, such as a 50W or 60W load chip, the mainstream 100W load chip is used...

AI Technical Summary

Problems solved by technology

[0002] Aluminum nitride ceramic substrate load sheets are mainly used to absorb the reverse input power of communication components in communication base stations. Previously, low-power products used alumina ceramics as substrates, and high-power products used beryllium oxide ceramics as substrates. Nitrogen The high-power load chip of aluminum ceramic substrate is an emerging industry, so there is a relatively concentrated phenomenon of load chip size and specification at home and abroad, and there is no customer-oriented diversified production, which leads to the general use of higher specification grades in the market to replace higher For low specification requirements, for example, when a 50W or 60W load chip is required, the mainstream 100W load chip is used

At the same time, manufacturing companies generally choose a relatively single size to complete their different designs in terms of substrate size. The disadvantages brought about by this are the relative weakening of the price advantage and the relative singleness of product selection.

At the same time, the design of the customer's product is limited, because the size of the load chip placement is limited. However, with continuous development, customers require the diversity of their own product design, which requires the size and specifications of the load chip to be diversified.

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