Metal-coated ceramic baseplate and manufacturing method thereof
A ceramic substrate, metal-clad technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of unusable power electronic devices, improve service life, improve temperature cycle reliability, manufacturing process simple effect
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[0015] The preparation method of the metal-ceramic substrate of the present invention is carried out according to the following steps,
[0016] (1), clean both sides of the ceramic substrate 1, the ceramic substrate 1 can be aluminum oxide (Al2O3), aluminum nitride (AlN), bismuth oxide (BiO2), silicon nitride (Si3N4), silicon carbide (SiC) one of them,
[0017] (2), the metal layer 2 is directly welded on the upper and lower sides of the ceramic substrate 1, such as direct copper welding on the upper and lower sides of the ceramic substrate 1, or the metal layer 2 is brazed on the upper and lower sides of the ceramic substrate 1, such as using active metal Brazing is to braze the metal layer on the upper and lower sides of the ceramic substrate 1, and the metal layer 2 is a copper layer or an aluminum layer or a copper-aluminum composite layer. In the present invention, there is a distance between the outer peripheral surface of the metal layer 2 and the outer peripheral surfa...
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