Any k-value and 8-value dram storage unit and writing and reading circuit

Abstract

The invention discloses a storage unit circuit, a write circuit and a read circuit for any K-valued and 8-valued DRAM (dynamic random access memory). The storage unit circuit comprises a voltage follower (F), a storage capacitor (Cj) of the grid of the voltage follower (F), a CMOS (complementary metal oxide semiconductor) transmission gate (G1) and a CMOS transmission gate (G2); in consideration of the direct-current level offset (Delta) between the input and output of the voltage follower (F), the write circuit is so designed that a multi-valued signal which is direct-current level offset (Delta) higher than the input of the write circuit can be provided; and in addition, since the voltage amplification factor of the voltage follower (F) is less than 1, the output waveform of the voltage follower (F) is smaller than the input waveform or is unequi-stepped, and the read circuit is designed for correction, the non-regular multi-valued signal is converted into a regular (equi-stepped) multi-valued signal. Both the write circuit and the read circuit have a good quantitative shaping effect, the original multi-valued information can be easily recovered when the voltage change of the storage capacitor (Cj) does not exceed a maximum new threshold and a minimum new threshold, and therefore the invention has anti-interference capability and multi-valued information-recovering capability. The invention is mainly used in the technical fields of VLSIs (very large-scale integrated circuit), such as FPGAs (field programmable gate array), CPLDs (complex programmable logic device), semi-custom or full-custom ASICs (application specific integrated circuit) and memories, and other digital ICs (integrated circuit).

Description

(1) Technical field [0001] The invention belongs to the field of digital integrated circuits, in particular to a storage unit circuit, a writing circuit and a reading circuit of an arbitrary K value and 8-value DRAM. (2) Technical background [0002] With the rapid development of MOS integrated circuit technology, the integration scale is getting larger and higher, and VLSI (Very Large Scale Integration) has some shortcomings: ① First, on the VLSI substrate, the wiring takes up more than 70% of the silicon Chip area; in programmable logic devices (such as FPGA and CPLD), there are also a large number of programmable internal wiring (including programmable connection switches, such as fuse switches, anti-fuse switches, floating gate programming components, etc.), To connect each logic function block or input / output to complete a specific function circuit, wiring (including programming connection switches) accounts for a large cost of materials. Reducing the proportion of wir...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of MOS integrated circuit technology, the integration scale is getting larger and higher, and VLSI (Very Large Scale Integration) has some shortcomings: ① First, on the VLSI substrate, the wiring takes up more than 70% of the silicon Chip area; in programmable logic devices (such as FPGA and CPLD), there are also a large number of programmable internal wiring (including programmable connection switches, such as fuse switches, anti-fuse switches, floating gate programming components, etc.), Connect each logic function block or input / output to complete a specific function circuit, wiring (including programming connection switch) accounts for a large cost of materials

[0006] 2. In the realization of multi-valued circuits, the existing technology to control the threshold of MOS transistors has great disadvantages: ① the amplitude of the control threshold is limited (because the ion implantation concentration is limited), and the resolution of opening is low; and the amplitude of the control threshold in the process is often Change the performance of the MOS tube, for example, the decrease of the threshold voltage will lead to a sharp increase of the cut-off current, the adjustment of the threshold voltage will affect the performance and stability of the tube, and the stable V tn Very important

Therefore, the current practical voltage-type multi-valued circuit is not larger than the 4-valued circuit, and the application of more-valued circuits is more difficult

② Only the amplitude of the threshold value can be controlled, and the turn-on nature of the MOS tube cannot be changed (such as changing ≥t conduction to <t conduction), and the multi-valued logic gate must have two kinds of MOS tubes with turn-on properties to make the structure of the combination circuit the simplest , for example, the circuit structures of multi-valued NOT gate, multi-valued right shift gate and multi-valued follower should be exactly the same, but the threshold voltage and its turn-on properties are different

However, the current technology that only controls the threshold amplitude makes the structure of the above-mentioned multi-valued gates very different and complicated, which affects its realization.

③ It is necessary to add an additional process of ion implantation, and the threshold can only be controlled in the semiconductor manufacturing process, which not only increases the complexity of the process, but also cannot be controlled by the user later, or the threshold cannot be programmed by the user

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