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Preparation method of glass-fiber-reinforced epoxy resin composite material modified by circuit board recovered powder and nanoparticles

A nanoparticle and glass fiber technology, applied in the field of comprehensive utilization of solid waste, can solve the problems of low interface bonding strength, low surface energy, poor interface performance of composite materials, etc. The effect of improving the interfacial bond strength

Inactive Publication Date: 2011-10-26
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high inertia of the glass fiber surface, low surface energy, few chemically active functional groups, low reactivity, and poor adhesion to the matrix, there are many defects in the interface of the composite material, and the interface bonding strength is low. poor defect

Method used

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  • Preparation method of glass-fiber-reinforced epoxy resin composite material modified by circuit board recovered powder and nanoparticles
  • Preparation method of glass-fiber-reinforced epoxy resin composite material modified by circuit board recovered powder and nanoparticles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment l

[0018] Example 1: Using glass fiber as the initial raw material, the glass fiber is modified by a silane coupling agent KH550 to obtain a surface-active glass fiber reinforcement; the dried circuit board recovery powder and the surface of the nanoparticles are activated, Then mixed with bisphenol A type epoxy resin (E-44) to obtain circuit board recycled powder and nano-particle filled epoxy resin matrix; finally, the glass fiber reinforcement modified by the coupling agent obtained above and The recycled circuit board powder is compounded with the epoxy resin matrix filled and modified by nanoparticles to obtain a glass fiber reinforced epoxy resin composite material modified by the recycled circuit board powder and nano particles.

[0019] Step (1): Weigh 200g of dry glass fiber, immerse the dry glass fiber in the silane coupling agent KH550 solvent at 40°C for 1 hour, take it out, and dry it at 60°C for 5 hours to obtain surface-coupled Reinforced glass fiber reinforced by ...

Embodiment 2

[0024] Example 2: Using glass fiber as the initial raw material, the glass fiber is modified by a silane coupling agent KH570 to obtain a surface-active glass fiber reinforcement; the dried circuit board recovery powder and nano-montmorillonite surface are activated treatment, and then mixed with bisphenol A epoxy resin (E-51) to obtain circuit board recycling powder and nano-montmorillonite filled epoxy resin matrix; finally, the above-obtained coupling agent modified glass The fiber reinforcement is compounded with recycled circuit board powder and nano-montmorillonite filled modified epoxy resin matrix to obtain a glass fiber reinforced epoxy resin composite material modified by circuit board recycled powder and nano-montmorillonite.

[0025]Step (1): Weigh 600g of dry glass fiber, immerse the dry glass fiber in the silane coupling agent KH570 solvent at 50°C for 2 hours, take it out, and dry it at 60°C for 2 hours to obtain surface-coupled Reinforced glass fiber reinforced...

Embodiment 3

[0031] Example 3: Using glass fiber as the initial raw material, the glass fiber is modified by a silane coupling agent KH560 to obtain a surface-active glass fiber reinforcement; the dried circuit board recovery powder and nano-silica surface are activated treatment, and then mixed with bisphenol A epoxy resin (E-54) to obtain circuit board recycling powder and nano-silica filled modified epoxy resin matrix; finally, the glass modified by the coupling agent obtained above The fiber reinforced body is compounded with recycled circuit board powder and nano-silica-filled modified epoxy resin matrix to obtain a glass fiber-reinforced epoxy resin composite material modified by circuit-board recycled powder and nano-silica.

[0032] Step (1): Weigh 100g of dried glass fiber, immerse the dried glass fiber in the silane coupling agent KH560 solvent at 40°C for 3 hours, take it out, and dry it at 80°C for 4 hours to obtain surface-coupled Reinforced glass fiber reinforced with chemica...

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Abstract

The invention belongs to the technical field of solid waste comprehensive utilization, and particularly relates to a preparation method of a glass-fiber-reinforced epoxy resin composite material modified by circuit board recovered powder and nanoparticles. The preparation method provided by the invention comprises the following steps of: modifying glass fibers with a coupling agent to obtain surface-activated glass fiber reinforcement; carrying out surface activating treatment on dry circuit board recovered powder and nanoparticles, and then mixing with epoxy resins to obtain an epoxy resin base body filled and modified by the circuit board recovered powder and nanoparticles; and finally compounding the coupling-agent-modified glass fiber reinforcement and the epoxy resin base body filled and modified by the circuit board recovered powder and nanoparticles to obtain the glass-fiber-reinforced epoxy resin composite material modified by circuit board recovered powder and nanoparticles. The preparation method utilizes the coupling-agent-treated glass fibers to improve the interfacial bonding properties between the glass fibers and the resin base body and to improve the interfacial bond strength of the composite material, utilizes the strength and toughness of the glass fibers to strengthen and toughen the resin base body, and utilizes the surface-activated recovered powder and nanoparticles to fill and modify the resin base body, thus improving the overall performance of the composite material and significantly improving the interfacial bond strength of the composite material and the mechanical properties of the glass fiber composite material, and can be widely applied in the fields of aerospace, automobile shipping, traffic transportation, mechatronics, etc.

Description

technical field [0001] The invention belongs to the technical field of comprehensive utilization of solid waste, and in particular relates to a preparation method of recycled circuit board powder and nano-particle modified glass fiber reinforced epoxy resin composite material. Background technique [0002] With the rapid development of information technology, information carriers and information materials, the life cycle of electronic products is getting shorter and shorter. These waste electronic products contain a lot of recyclable substances. Unreasonable disposal and recycling will not only cause a large amount of useful resources At the same time, it will cause serious harm to the environment and human health. Epoxy resin is one of the most widely used thermosetting resin matrices in polymer-based composite materials. It has excellent adhesive properties, wear resistance, mechanical properties, electrical insulation properties, chemical stability, and high and low tempe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/00C08K9/06C08K9/04C08K7/14C08K3/26C08K3/34C08K3/36C08K3/22
Inventor 邱军王宗明
Owner TONGJI UNIV
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