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Flexible substrate, flexible AMOLED (Active Matrix/Organic Light Emitting Diode) and flexible PMOLED (Passive Matrix/Organic Light Emitting Diode)

A flexible substrate and substrate technology, applied in the direction of circuit substrate materials, electrical components, circuits, etc., can solve the problems of OLED failure, high permeability, poor temperature stability, etc., and achieve low water and oxygen transmission rate, strong adhesion performance, good transparency effect

Inactive Publication Date: 2011-10-19
SHENZHEN DANBANG INVESTMENT GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing flexible substrates such as PET have poor temperature stability and cannot withstand subsequent processing techniques; they have poor flatness and must undergo complex leveling treatments before they can be applied to OLEDs; the high permeability of water and oxygen seriously affects the life of OLEDs; substrates and The bonding force between ITO and OLED transparent electrodes is weak, which can easily cause the transparent electrodes to crack and fall off, making OLED invalid
[0004] Existing flexible substrates such as DuPont's Kapton, its polymer film has a deep color (yellow or brown), poor optical transparency

Method used

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  • Flexible substrate, flexible AMOLED (Active Matrix/Organic Light Emitting Diode) and flexible PMOLED (Passive Matrix/Organic Light Emitting Diode)
  • Flexible substrate, flexible AMOLED (Active Matrix/Organic Light Emitting Diode) and flexible PMOLED (Passive Matrix/Organic Light Emitting Diode)
  • Flexible substrate, flexible AMOLED (Active Matrix/Organic Light Emitting Diode) and flexible PMOLED (Passive Matrix/Organic Light Emitting Diode)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A flexible substrate, comprising a polyimide substrate, an inorganic layer is arranged on the polyimide substrate, at least one polyimide layer is arranged on the inorganic layer, and each layer of the polyimide An inorganic layer is also provided on the imide layer.

[0026] Such as figure 1 As shown, in a preferred embodiment, the bottom of the polyimide substrate is also provided with an inorganic protective layer, the material of the inorganic layer is at least one of silicon dioxide, silicon oxynitride, aluminum oxide and aluminum nitride, inorganic The material of the protective layer is at least one of silicon dioxide, silicon oxynitride, aluminum oxide and aluminum nitride. In this embodiment, the material of each inorganic layer is the same, and the material of the inorganic protective layer is the same as that of the inorganic layer. It is also the same (in practice, different materials can be used for each inorganic layer, and the material of the inorganic p...

Embodiment 2

[0034] The difference with Embodiment 1 is that: using SiO 2 As the material of the inorganic protective layer and each inorganic layer, SiO is grown on the PI substrate 2 by magnetron sputtering, electron beam evaporation, and PECVD. 2 Film, the layer of film has compressive stress. Process parameters when using PECVD technology: PI substrate temperature is 25°C-300°C, RF power is 20-200W, background vacuum is 5×10 -3 Pa, RF power frequency 13.56MHz, working gas is 10% silane SiH 4 and 99.999% of N 2 O, N 2 O:SiH 4 The flow ratio is 1:1-2:1.

Embodiment 3

[0036] Such as figure 2 As shown, a flexible passively driven organic light-emitting device includes a flexible substrate and a passive organic light-emitting device disposed on the flexible substrate, wherein the flexible substrate is the flexible substrate in Embodiment 1 or Embodiment 2.

[0037] The passively driven organic light emitting device sequentially comprises an anode transparent conductive layer 6 , an organic functional layer 7 on the anode transparent conductive layer 6 , and an OLED cathode 8 on the organic functional layer 7 .

[0038] The anode transparent conductive layer 6 of OLED is formed on the inorganic layer 5 in the flexible substrate, and it can adopt ITO (In 2 o 3 :Sn), SnO 2 :F, SnO 2 : Sb, IZO (ZnO:In), AZO (ZnO:Al), etc., preferably an amorphous transparent conductive layer, such as ZnO:Ga.

[0039] The radio frequency magnetron sputtering apparatus is carried out at room temperature, the sputtering frequency is 13.56MNHz, and the background ...

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Abstract

The invention discloses a flexible substrate, which comprises a polyimide substrate, wherein an inorganic layer is arranged on the polyimide substrate and is provided with at least one polyimide layer; and inorganic layers are also respectively arranged on the polyimide layers. The inorganic layers and the PI (Polyimide) layers form an alternating structure; the PI layers have favorable transparency and play a role of flattening; and the inorganic layers have excellent performances for resisting water and oxygen, and the like, so that the flexible substrate has the advantages of favorable flatting performance, low water and oxygen transmissivity, strong adhesion property, and the like.

Description

technical field [0001] The present invention relates to a flexible substrate, in particular to a flexible substrate for a flexible organic light emitting device and a flexible organic light emitting device based on the flexible substrate. Background technique [0002] Organic Light Emitting Diode (OLED for short) due to its low energy consumption, high resolution, high brightness, high luminous efficiency, fast response, wide viewing angle, no backlight, low cost, and low driving voltage And many other advantages, it has broad research and application prospects in the fields of flat panel display and light source. In particular, OLED has all-solid-state characteristics, no vacuum cavity, no liquid components, good mechanical properties, and strong shock resistance. Using plastic, polyester film or film as the substrate, the OLED screen can be made thinner, and can even be folded or rolled. Together, flexible soft screen display and flexible light source can be realized. ...

Claims

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Application Information

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IPC IPC(8): H05K1/03H01L51/52
Inventor 刘萍
Owner SHENZHEN DANBANG INVESTMENT GROUP
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