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Nano copper powder for electronic paste and preparation process

A nano-copper powder and a production process technology, applied in the field of nano-copper powder and its preparation process, can solve the problems of easy agglomeration of particles, difficult control of particle size distribution range and morphology, toxicity or pollution of reducing agents, etc., and achieve particle size distribution. Uniform, light particle agglomeration, high productivity

Inactive Publication Date: 2011-10-05
SHENZHEN SENLONT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The liquid-phase deposition method under normal temperature and pressure is the main method for industrially preparing nano-copper powder, but there are problems such as easy agglomeration of particles, difficult control of particle size distribution and shape, toxicity or pollution of reducing agents, etc., so water The thermal method shows its unique advantages

Method used

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  • Nano copper powder for electronic paste and preparation process
  • Nano copper powder for electronic paste and preparation process
  • Nano copper powder for electronic paste and preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Take by weighing 500g copper sulfate pentahydrate and be dissolved in 3L deionized water, stir to make it dissolve completely, slowly add the strong ammoniacal liquor (28%) of 875g until solution is clear and transparent, be heated to 45 ℃; Take by weighing 2g sodium lauryl sulfate ( SDS) and 1g OP-10 were dissolved in 1L deionized water, and then the aqueous solution of the dispersant was slowly added to the copper sulfate aqueous solution, and stirred to disperse it evenly to form a mixed solution A. Weigh 540g of glucose and add it to A, stir to dissolve it to form a mixed solution B, add B to a 6L stainless steel high-temperature reaction kettle with a Teflon liner, tighten the reaction kettle, put it in an oven and heat it to 120°C , keep it warm for 2 hours, then cool down to room temperature naturally, take out the mixed solution, filter out the precipitate, wash it several times with deionized water and ethanol, put it in a vacuum drying oven, and dry it at 40°C ...

Embodiment 2

[0043] Weigh 500g of copper sulfate pentahydrate and dissolve it in 3L of deionized water, stir to dissolve it completely, slowly add 500g of sodium tartrate until the solution is clear and transparent, heat to 45°C; weigh 2g of sodium dodecylbenzenesulfonate (SDBS) and 2g of polyvinyl alcohol (PVA) were dissolved in 1L of deionized water, and then the aqueous solution of the dispersant was slowly added to the copper sulfate aqueous solution, and stirred to disperse it evenly to form a mixed solution A. Weigh 250g of ethylene glycol and add it to A, stir to dissolve it to form a mixed solution B, add B to a 6L stainless steel high-temperature reactor with a polytetrafluoroethylene lining, tighten the reactor, and heat it in an oven until 190°C, keep warm for 4h, then cool down to room temperature naturally, take out the mixed solution, filter out the precipitate, wash several times with deionized water and ethanol, place in a vacuum drying oven, dry at 40°C for 4h, and finally ...

Embodiment 3

[0048] Weigh 500g of copper sulfate pentahydrate and dissolve it in 3L of deionized water, stir to dissolve it completely, slowly add 600g of sodium citrate until the solution is clear and transparent, and heat to 45°C; weigh 2g of sodium dodecyl sulfate (SDS) and Dissolve 2 g of polyvinyl alcohol (PVA) in 1 L of deionized water, then slowly add the aqueous solution of the dispersant to the aqueous solution of copper sulfate, and stir to disperse it evenly to form a mixed liquid A. Weigh 250g of ethylene glycol and add it to A, stir to dissolve it to form a mixed solution B, add B to a 6L stainless steel high-temperature reactor with a polytetrafluoroethylene lining, tighten the reactor, and heat it in an oven until 190°C, keep warm for 3h, then cool down to room temperature naturally, take out the mixed solution, filter out the precipitate, wash several times with deionized water and ethanol, place in a vacuum drying oven, and dry at 40°C for 4h, and finally obtain high-purity...

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Abstract

The invention discloses nano copper powder for electronic paste and a preparation process. The process is characterized in that: nano copper powder is prepared through the reduction of a reducing agent under the condition of the temperature and the pressure which are produced by a hydrothemal method, and nano copper powder with different appearances and grain diameters can be prepared under the conditions of different temperatures, pressures, reducing agents and dispersing agents. The method comprises the following steps of: adding aqueous solution of a complexing agent into aqueous solution of water soluble copper salt to form the complex aqueous solution of copper; adding an appropriate amount of dispersing agent, stirring to uniformly disperse the mixture, adding an appropriate amount of reducing agent, and adding the finally-obtained mixed solution into a stainless steel high-temperature reaction kettle with a polytetrafluoroethylene lining; heating to a certain temperature; preserving heat for certain time; naturally reducing temperature to room temperature; filtering off precipitate; cleaning by using deionized water and ethanol for multiple times; and performing vacuum drying to finally obtain high-purity nano copper powder with high surface activity and controllable granularity.

Description

technical field [0001] The application of the present invention relates to an electronic material, in particular to a nano-copper powder that can be used to manufacture electronic paste and its preparation process. technical background [0002] Electronic paste is the basic material for the manufacture of thick film components. It is a paste made of solid powder and organic solvents that are mixed uniformly by three-roll rolling. According to different purposes, it is divided into dielectric paste, resistance paste and conductor paste; according to the type of substrate, it is divided into ceramic substrate, polymer substrate, glass substrate and metal insulating substrate electronic paste, etc.; according to different sintering temperature , can be divided into high temperature, medium and low temperature drying electronic paste; according to different purposes, it can be divided into general electronic paste (making general thick film circuits) and special electronic paste...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24
Inventor 叶志龙刘宗义
Owner SHENZHEN SENLONT ELECTRONICS
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