Heterojunction field effect transistor based on channel array structure
A technology of heterojunction field effect and channel array, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., and can solve the problems of very difficult process control of trench gate technology
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Embodiment 1
[0058] refer to Figure 1a , the Schottky gate heterojunction field effect transistor based on channel array structure is composed of heterojunction epitaxial material (including semiconductor 1 and semiconductor 2), source 3, drain 4, channel array 5 and gate 6 . Wherein, the semiconductor 1 and the semiconductor 2 constituting the heterojunction can be any semiconductor material that can form a two-dimensional electron gas 7 at the heterojunction. The two-dimensional electron gas 7 in the channel is adjusted and controlled through the gate 6, so as to control the device to be in the cut-off region, the linear region and the saturation region. The channel array 5 is formed by a plurality of channels 8 connected in parallel, and is located between the source 3 and the drain 4 and in the active region below the gate 6 . In this embodiment, the gate 6 is between the channel arrays 5, which can be Figure 1b and Figure 1c clearly seen in. And by figure 2 It can be seen tha...
Embodiment 2
[0060] refer to image 3 , the insulated gate heterojunction field effect transistor based on the channel array structure includes a semiconductor 1 , a semiconductor 2 , an insulating dielectric layer 9 and a gate 6 . A high-density two-dimensional electron gas exists at the heterojunction interface. An insulating dielectric layer covers the channel array 5 , and the uppermost layer is covered with gate metal to modulate the two-dimensional electron gas in the channel. Wherein, the insulating dielectric layer may be an oxide (such as silicon dioxide, aluminum oxide, hafnium oxide, etc.), or a non-oxide dielectric layer (such as silicon nitride, aluminum nitride, etc.). According to this embodiment, taking an AlGaN / GaN HEMT as an example, a layer of Al with a thickness of 10 nm is deposited between the gate 6 metal and AlGaN by ALD. 2 o 3 , can reduce the gate leakage current by four orders of magnitude, and effectively enhance the control ability of the gate to the channel...
Embodiment 3
[0062] refer to Figure 4 , the single channel heterojunction field effect transistor includes a semiconductor 1 , a semiconductor 2 , a source 3 , a drain 4 , a channel 8 and a gate 6 . A high-density two-dimensional electron gas 7 exists at the heterojunction interface. The device consists of a single channel 8, and the gate 6 covers both sides of the channel 8 to modulate the two-dimensional electron gas 7 at the heterointerface. The source 3 is grounded, and the drain 4 is applied with a forward voltage to make channel electrons flow from the source 3 to the drain 4 . According to this embodiment, taking the AlGaN / GaN heterojunction as an example, the width of the channel 8 is 500nm, the metal thickness of the gate 6 is 300nm, and the length of the gate 6 is 300nm. gs =1.5V when the saturation leakage current is 850mA / mm, the maximum peak transconductance is 195mS / mm, compared with the traditional AlGaN / GaN HEMT device at V gs The saturation leakage current at 1.5V is 5...
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