Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding

A microfluidic chip and thermocompression bonding technology, applied in the field of micromanufacturing, can solve the problems of complex processing methods, affecting the performance of microfluidic systems, and high cost, and achieve high efficiency processing methods, increased bonding rate, and low cost. Effect

Inactive Publication Date: 2013-10-16
DALIAN UNIV OF TECH
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Problems solved by technology

[0004] The technical problem to be solved in the present invention is: to overcome problems such as complex treatment methods, high cost, and influence on the performance of the microfluidic system that exist in the treatment methods such as ultraviolet rays and MMA monomer surface modification, and for injection molding PMMA microfluidic chips, a new method is proposed. A Water Treatment Method for Improving the Quality of Its Thermocompression Bonding

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  • Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding
  • Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding
  • Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding

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example

[0025] Example: A microfluidic chip with a size of 78×28mm is fabricated by using water treatment method. Attached figure 1 The process of making the chip, the specific steps are as follows:

[0026] 1. Injection molding PMMA microfluidic chip:

[0027] The cover and substrate of the PMMA microfluidic chip were injection-molded (equipment model: Zhende CJ80M3V injection molding machine), the mold temperature was 85°C, the melt temperature was 250°C, the filling time was 3s, the injection pressure was 140Mpa, and the holding time was 3s. The overall size of the chip obtained by injection molding is 82×40mm, in which there is a "cross-shaped" microchannel pattern on the cover sheet. The small hole of Φ2 is the chip reservoir, see attached figure 2 , 3 .

[0028] 2. Laser cutting chip cover and substrate:

[0029] Laser cut the chip cover and substrate (equipment model: Leishen CLS2000 laser engraving and cutting machine), the cutting current is 3.5mA, the knife passes 2 t...

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Abstract

Provided is a method for raising the hot pressing bonding rate of a PMMA micro fluidic chip formed by injection moulding. The invention is directed to the field of micro manufacture technology, especially relates to a method for raising the hot pressing bonding quality of a micro fluidic chip. The method is characterized in that carrying out water processing before hot pressing bonding; unlike a traditional hot pressing bonding process flow of from ultrasonic cleaning to drying in a baking oven to hot pressing bonding, a new process flow of from ultrasonic cleaning to water processing to drying the surface with nitrogen to hot pressing bonding is adopted. According to the invention, problems of complex processing method, high cost and negative influence on system operational performance in processing methods such as ultraviolet ray and MMA monomer surface modification and the like are overcome. The processing method is characterized by high efficiency, low cost, unchanged microfluid system performance and simple operation. At a same hot pressing bonding technological parameter, compared to untreated chips, the effective bonding areas of the chips treated with the method provided in the invention substantially increase, the bonding rates averagely increase 20 percent, thereby the bonding quality of the chips is effectively improved.

Description

technical field [0001] The invention belongs to the technical field of micro-manufacturing, and in particular relates to a method for improving the quality of thermocompression bonding of a micro-fluidic chip. Background technique [0002] Polymer microfluidic chips have been widely used in the fields of life science, medicine, food and environmental sanitation inspection due to their small size, low cost, portability, fast analysis speed, and fewer samples required for analysis. Currently commonly used polymer materials include polycarbonate (PC), polydimethylsiloxane (PDMS), and polymethyl methacrylate (PMMA). The methods used for bonding PMMA microfluidic chips mainly include thermocompression bonding, adhesive bonding, ultrasonic bonding and laser bonding, among which thermocompression bonding is the most widely used. In order to improve the production efficiency of the chip, the cover sheet and the substrate of the chip are usually obtained by injection molding with an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C3/00
Inventor 杜立群常宏玲付其达刘冲
Owner DALIAN UNIV OF TECH
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