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Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof

An electronic packaging, low-cost technology, applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of many types of added elements, complex metallurgical preparation, melting point of solidification cracks, etc., to achieve excellent solderability and comprehensive mechanical properties , The preparation process is simple, and the effect of reducing the generation of solidification cracks

Inactive Publication Date: 2011-09-07
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the technical problems of the existing lead-free solder with low silver content, which still have high silver content, many types of added elements, complex metallurgical preparation, easy to produce solidification cracks and high melting point, and provide an electronic Low-cost anti-aging solder for packaging and preparation method thereof

Method used

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  • Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof
  • Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof
  • Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof

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specific Embodiment approach 1

[0009] Embodiment 1: A low-cost anti-aging solder for electronic packaging in this embodiment consists of 0.60% to 0.79% Ag, 0.50% to 0.90% Cu, 0.02% to 0.20% Ni, and 2.10% -4.00% Bi and the balance Sn.

[0010] The low-cost anti-aging solder for electronic packaging in this embodiment reduces the cost of the solder and at the same time obtains excellent solderability and comprehensive mechanical properties. The silver content of the solder is 0.60% to 0.79%, and the silver content is relatively low. Melting point is only 205℃~219℃, good wettability and good solderability. Compared with SAC305 solder, its cost can be reduced by 30% to 43%, the melting point and wettability of the solder are improved, the shear strength of the brazed joint is increased by more than 40%, and the high temperature aging resistance is obviously improved. Compared with SAC0307 solder, the melting point and wettability of the solder have been significantly improved, and the shear strength of the bra...

specific Embodiment approach 2

[0011] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the low-cost anti-aging solder for electronic packaging is composed of 0.63% to 0.75% Ag, 0.60% to 0.80% Cu, and 0.05% to 0.18% by mass percentage. Ni, 2.30% to 3.50% Bi and the rest of Sn.

specific Embodiment approach 3

[0012] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the low-cost anti-aging solder for electronic packaging is composed of 0.70% Ag, 0.70% Cu, 0.10% Ni, 2.80% Bi and the rest amount of Sn composition.

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Abstract

The invention relates to a low-cost anti-aging brazing filler material used for electronic packaging and a preparation method thereof, relating to a soft brazing filler material and a preparation method thereof. The invention solves the technical problems that the traditional low silver content lead free brazing filler material has higher silver content, multiple elements are added, metallurgy preparation is complex, a curing crack can be easily caused and the melting point is higher. The brazing filler material comprises the following components: 0.60-0.79% of Ag, 0.50-0.90% of Cu, 0.02-0.20% of Ni, 2.10-4.00% of Bi and the balance of Sn. The preparation method comprises the step of carrying out smelting on Sn, Ag, Cu, Ni and Bi for twice, thus the brazing filler material is obtained. The melting point of the brazing filler material is 205-219 DEG C, the wettability and weldability are good, the cost is reduced by 30-43% compared with the brazing filler material SAC305, and the jointstrength and high temperature aging resistance of the brazing filler material are improved compared with SAC305 and SAC0307. The brazing filler material provided by the invention can be applied to the fields of electronic packaging, manual welding of packaging, wave soldering and reflow soldering.

Description

technical field [0001] The present invention relates to solder and its preparation method Background technique [0002] SnAgCu-based solder alloys have been widely recognized as an alternative to traditional SnPb solder alloys. At present, the more recognized and commonly used ones include Sn-3.9Ag-0.6Cu recommended by the United States, Sn-3.8Ag-0.7Cu recommended by the European Union, and Sn-3.8Ag-0.7Cu recommended by Japan. ~3.0Ag~0.5Cu. The silver content of the above-mentioned solders is generally more than 3%, and they are widely used in the field of lead-free electronic packaging, and their process parameters are relatively mature. However, higher silver content will lead to more Ag generated inside the solder 3 Sn intermetallic compounds are formed, and the impact resistance of brazing joints is reduced. More importantly, the higher silver content increases the cost of the solder; if the silver content in the solder is reduced, it will lead to the formation of Ag i...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C13/02C22C1/02
Inventor 孙凤莲刘洋
Owner HARBIN UNIV OF SCI & TECH
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