Method of cleaning and micro-etching semiconductor wafers

Abstract

A method of simultaneously cleaning inorganic and organic contaminants from semiconductor wafers and micro-etching the semiconductor wafers. After being cut or sliced from ingots, semiconductor wafers are contaminated with cutting fluid as well as metal and metal oxides from the saws used in the cutting process. Aqueous alkaline cleaning and micro-etching solutions containing alkaline compounds and mid-range alkoxylates are used to simultaneously clean and micro-etch the semiconductor wafers. The method provided includes the steps of a) providing semiconductor ingots; b) cutting the semiconductor ingots to form one piece or pieces of semiconductor wafers containing inorganic and organic contaminants; and c) applying an aqueous alkaline solution comprising one or more quaternary ammonium hydroxides, one or more alkali hydroxides and one or more mid-range alkoxylates in sufficient amounts to remove the contaminants and micro-etch the semiconductor wafers.

Description

technical field [0001] The invention relates to a method for simultaneously cleaning a semiconductor wafer from inorganic and organic contaminants and microetching the semiconductor wafer. More specifically, the present invention relates to a method of simultaneously cleaning a semiconductor wafer from inorganic and organic contaminants and microetching the semiconductor wafer using an alkaline aqueous solution comprising an alkaline compound and a mid-range alkoxylate. Background technique [0002] Traditionally, semiconductor wafers can be manufactured through the following steps: [0003] (1) cutting a semiconductor ingot by an inner diameter saw to obtain wafers; [0004] (2) washing the wafer with water to remove contaminants; and [0005] (3) The wafer is then cleaned to remove contaminants including heavy metals and particles and then dried. [0006] Such wafers are typically used in the manufacture of photovoltaic devices such as solar cells. A solar cell is a de...

AI Technical Summary

Problems solved by technology

Some alkaline cleaners have been found to remove organic materials well but not metals

Therefore, there is a need in the semiconductor industry for an improved method of removing contaminants from semiconductor wafers to improve the overall performance and appearance of the semiconductor wafer, as well as to minimize contamination of the wafer with conductive metals that can reduce the size of the solar cell. s efficiency