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Manufacturing method of terminal electrode of laminated type electronic component

A technology for electronic components and manufacturing methods, which is applied in the manufacture of inductors/transformers/magnets, electrical components, and resistors with lead-out ends, etc. Poor and other problems, to achieve the effect of less impact on the electrical properties of the product and increased bonding force

Active Publication Date: 2011-08-17
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the firing temperature of the product porcelain body is generally higher than that of the terminal electrodes, and the firing and holding time of the product porcelain body is much longer than that of the terminal electrodes, the above-mentioned addition of a certain proportion of low-melting glass components When the terminal paste is used, the glass component will be easily enriched in the silver layer, precipitated and distributed on the surface of the terminal electrode, and a continuous glass phase will be formed inside and on the surface of the terminal electrode silver layer, which will seriously affect the quality of the product after electroplating. Welding performance
Therefore, only the internal electrode silver paste without adding glass components can be used, but there are problems due to the matching of sintering shrinkage and the wettability between materials, resulting in the defect of poor bonding between the silver layer and the porcelain body, which is likely to cause product failure. terminal electrode off
As for the special silver paste provided by a few material manufacturers for product surface printing and sintering together with the product, it is only suitable for certain ceramic materials, not only has no versatility, but also is too expensive

Method used

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  • Manufacturing method of terminal electrode of laminated type electronic component
  • Manufacturing method of terminal electrode of laminated type electronic component

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specific Embodiment approach 1

[0025] A method for manufacturing a terminal electrode of a laminated chip electronic component, comprising the following steps:

[0026] 1) Make external electrodes

[0027] When the product is laminated and formed, the outer electrode is made by printing on the surface of the product forming body; the printing method is the SP0803 inner electrode silver paste added with L4.6 ceramic powder produced by FERRO company used in the product. Grind the L4.6 ceramic body powder three times with a planetary mill until the average particle size D50 is 0.6 μm; add L4.6 ceramic body powder to the SP0803 inner electrode silver paste and then use a three-roller mill Grind three times to mix the slurry evenly. Table 1 is the external electrode effect of seven different L4.6 ceramic powder additions:

[0028] Table 1

[0029]

[0030] Table 1 shows that the amount of L4.6 porcelain body powder added is 0.6-3.0 (wt)% of the weight of the inner electrode silver paste, and the external e...

specific Embodiment approach 2

[0041] A method for manufacturing a terminal electrode of a laminated chip electronic component, the steps of which are the same as those of the silver paste and the first embodiment. The amount of L4.6 ceramic body powder added is 0.8 (wt)% of the weight of the silver paste of the inner electrode of SP0803. After the silver paste is added to the porcelain powder, it is rolled three times with a three-roll mill. Table 2 is the external electrode effect of six different L4.6 ceramic powders with an average particle size of D50:

[0042] Table 2

[0043]

[0044] Table 2 shows that the amount of L4.6 porcelain body powder added is 0.8 (wt)% of the silver paste weight of the inner electrode, and the porcelain body powder is a porcelain body powder with an average particle size D50 of 0.4-0.8 μm. The electrode has no warping, no shedding, and the silver layer is bright.

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Abstract

The invention discloses a manufacturing method of a terminal electrode of a laminated type electronic component, comprising the following steps of: manufacturing an outer electrode; and manufacturing an integral terminal electrode. The manufacturing method is characterized in that the integral terminal electrode is manufactured in a printing way; printing silver pastes are inner electrode silverpastes added with porcelain powder for products, and the adding amount of the porcelain powder accounts for 0.6-3.0 percent by the weight of the inner electrode silver pastes. According to the invention, the traditional inner electrode silver pastes are improved, the bonding force of the inner electrode silver pastes and product porcelains can be remarkably increased without generating the ascentof low-melting-point glass when terminal pastes are directly adopted, and the inference of the terminal electrode manufactured in the traditional silver bonding way on the electrical property of the products can be reduced to be minimum.

Description

technical field [0001] The invention relates to electrode manufacturing, in particular to a method for manufacturing terminal electrodes of laminated electronic components. Background technique [0002] Most of the terminal electrodes of the existing laminated chip electronic components are coated with a silver layer to form the terminal electrode on the porcelain body of the product by means of silver sticking or rubber wheel pad printing after the porcelain body of the product is fired, and then fired at high temperature. Silver forms the terminal electrodes, and finally the terminal electrodes have good soldering properties by electroplating. The special silver paste forming the terminal electrode coating is also called the terminal paste, and a certain proportion of low-melting glass components are added to enhance the bonding force between the silver layer and the porcelain body. However, the terminal electrodes of some laminated chip electronic components for special ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/02H01C7/04H01C17/28H01F27/29H01F41/00
Inventor 戴春雷伍检灿孙峰刘宁
Owner SHENZHEN SUNLORD ELECTRONICS
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