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Method for preparing bionic adhesion arrays with different top end structures

An array and biomimetic technology, applied in the field of biomimetic adhesion array preparation, can solve the problems of single, complex and difficult operation of the top shape, and achieve the effect of broadening the scope of application and enriching research methods.

Inactive Publication Date: 2011-04-13
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there are many methods for preparing bionic adhesive materials, there are many parameters related to the structure of gecko toe setae, and they are related to each other. It is still a challenge to find a suitable composition material and the best condition to match the structural parameters complex job
In particular, the shape of the top of the existing biomimetic adhesion array is relatively simple, most of which are planar or spherical structures. Sitti and Campo respectively reported on page 261911 of "Appl. Volume 19, page 1973, reported that a biomimetic adhesive array with tip topography was prepared, but their preparation method required three-dimensional structure templates and spot dipping techniques, which were complicated, difficult to operate, and had great limitations

Method used

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  • Method for preparing bionic adhesion arrays with different top end structures
  • Method for preparing bionic adhesion arrays with different top end structures
  • Method for preparing bionic adhesion arrays with different top end structures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Sequentially wash the silicon substrate with concentrated sulfuric acid, rinse with deionized water, and dehydrate and bake to remove pollutants on the surface of the silicon substrate; remove water vapor, make the surface of the substrate change from hydrophilic to hydrophobic, and enhance Adhesion to the surface.

[0027] (2) Using a mask plate with hexagonally arranged solid chromium dots, the diameter of the chromium dots is 3 microns, and the pitch is 3 microns, and a photoresist mask pattern is obtained on the surface of the silicon substrate through an ultraviolet lithography process.

[0028] (3) Inductively coupled plasma etching is performed on the silicon substrate with a photoresist mask to obtain a micron column array, the column diameter is 3 microns, the pitch is 3 microns, the length (height) is 8 microns, and hexagonal arrangement.

[0029] (4) A soft template (template-1) with a micro-hole array structure was prepared by polydimethylsiloxane pourin...

Embodiment 2

[0032] Cover the water-soluble polyurethane (PU) material directly on the template-1, put it into the oven for drying and curing, the curing temperature is 40°C, and the curing time is 10 hours. Finally, the mold is demoulded to obtain the bionic micro-structure adhesion with the shape of the arc-shaped top array.

Embodiment 3

[0034] Cover the dimethylformamide solution of polymethyl methacrylate (PMMA) directly on the template-1, put it in an oven to dry and cure, the curing temperature is 60°C, and the curing time is 15 hours, and finally demolded to obtain a flat top Topography of Adhesive Arrays of Bioinspired Microstructures.

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Abstract

The invention discloses a novel method for preparing bionic adhesion micron-sized pillar arrays with different top end shapes. Top end structures are spatula-shaped, arc-shaped, planar and sunken respectively; pillars have micron-grade diameters; and the array has a high-aspect ratio structure. The method comprises the following steps of: forming a micron-sized pillar array on a silicon substrateby utilizing ultraviolet lithography and inductively-coupled plasma etching as main technical means; preparing a soft template with a micron-sized hole array structure by taking polydimethylsiloxane as a replication material; and performing film molding and curing on the solvent solution of high polymer material in the template by adopting different processes to obtain bionic adhesion micron-sized pillar array materials. The bionic adhesion materials obtained by the method have potential application value in the fields of biomedicine, precision industries, climbing robots and the like.

Description

Technical field: [0001] The invention discloses a new method for preparing bionic adhesion arrays with different tip structures, and relates to the fields of material chemistry and micromachining. Background technique: [0002] In nature, geckos have the perfect ability to climb walls. Inspired by this, it has become a research hotspot to study the wall-climbing adhesion mechanism of gecko and imitate the wall-climbing behavior of gecko. In 2000, Autumn and Full reported on page 681 of volume 405 of "Nature" that the adhesion force of gecko feet comes from the intermolecular force - Van der Waals force. Microscopic studies have shown that there are millions of setae arrays with micro-nano structures distributed on the paws of geckos, and the top of each seta has a spatula-like structure, which ensures that each seta has a good and close contact with the contact surface. The accumulation of van der Waals force generated by the close contact between these bristles and the wa...

Claims

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Application Information

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IPC IPC(8): G03F7/00C08L75/04C08L33/12C04B41/49B82Y40/00
Inventor 王大朋赵爱武梅涛
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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