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Formula and preparation method of plating solution as well as method for plating aluminum base plate

A technology of aluminum substrate and plating solution, applied in the field of metal surface treatment, can solve the problems of high processing cost, poor mechanical strength, affecting the welding performance of circuit boards, etc., and achieve the effect of reducing processing cost, good mechanical strength, and good welding performance.

Inactive Publication Date: 2011-04-06
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The processing cost of gold plating and silver plating is very high, and the mechanical strength of HASL at low temperature is not good, which affects the soldering performance of the circuit board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Preparation of tin-bismuth alloy plating solution: Weigh tin sulfate (analytical pure), sulfuric acid (analytical pure), bismuth nitrate (analytical pure) and leather glue according to the formula. Inject 1 / 3 of tap water into the plating solution tank, add 1 / 2 of the proportion of sulfuric acid to acidify the water; add the proportion of tin sulfate, and stir carefully with a glass rod; then add the remaining sulfuric acid and proportion of nitric acid bismuth, and stir carefully. Leather glue needs to be put in cold water to make it expand, then dissolved in hot water and poured into the tank. Add tap water to the tank up to the working level and stir carefully with a glass rod. The components of the plating solution are: tin sulfate: 40g / l; sulfuric acid: 100g / l; bismuth nitrate: 0.3g / l; leather glue: 0.5g / l.

[0018] Preparation of aluminum pickling solution: measure sulfuric acid and nitric acid according to the formula, and weigh the sodium chloride of the formu...

Embodiment 2

[0025] Preparation of tin-bismuth alloy plating solution: Weigh tin sulfate (analytical pure), sulfuric acid (analytical pure), bismuth nitrate (analytical pure) and leather glue according to the formula. Inject 1 / 3 of tap water into the plating solution tank, add 1 / 2 of the proportion of sulfuric acid to acidify the water; add the proportion of tin sulfate, and stir carefully with a glass rod; then add the remaining sulfuric acid and proportion of nitric acid bismuth, and stir carefully. Leather glue needs to be put in cold water to make it expand, then dissolved in hot water and poured into the tank. Add tap water to the tank up to the working level and stir carefully with a glass rod. The components of the plating solution are: tin sulfate: 60g / l; sulfuric acid: 130g / l; bismuth nitrate: 1.5g / l; leather glue: 5.0g / l.

[0026] Preparation of aluminum pickling solution: measure sulfuric acid and nitric acid according to the formula, and weigh the sodium chloride of the formu...

Embodiment 3

[0033] Preparation of tin-bismuth alloy plating solution: Weigh tin sulfate (analytical pure), sulfuric acid (analytical pure), bismuth nitrate (analytical pure) and leather glue according to the formula. Inject 1 / 3 of tap water into the plating solution tank, add 1 / 2 of the proportion of sulfuric acid to acidify the water; add the proportion of tin sulfate, and stir carefully with a glass rod; then add the remaining sulfuric acid and proportion of nitric acid bismuth, and stir carefully. Leather glue needs to be put in cold water to make it expand, then dissolved in hot water and poured into the tank. Add tap water to the tank up to the working level and stir carefully with a glass rod. The components of the plating solution are: tin sulfate: 50g / l; sulfuric acid: 120g / l; bismuth nitrate: 1g / l; leather glue: 3g / l.

[0034] Preparation of aluminum pickling solution: measure sulfuric acid and nitric acid according to the formula, and weigh the sodium chloride of the formula. ...

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PUM

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Abstract

The invention discloses a formula and a preparation method of a plating solution for plating a tin-bismuth alloy as well as a method for plating an aluminum base plate. The formula of the plating solution comprises the following components by weight: 40-60 g / l of tin sulfate, 100-130 g / l of sulfuric acids, 0.3-1.5 g / l of bismuth nitrate and 0.5-5.0 g / l of leather glues. The preparation method comprises the following steps of: firstly weighing the tin sulfate, the sulfuric acids, the bismuth nitrate and the leather glues in proportion; injecting one third of running water into a plating solution tank, and adding the sulfuric acids with half of the proportional quantity to acidize the running water; adding the tin sulfate in proportion; then adding the rest sulfuric acids and the bismuth nitrate in proportion; adding the dissolved leather glues; and adding the running water to the plating solution tank to a working solution level. The method for placing the aluminum base plate by using the plating solution comprises the following steps of: deoiling; scouring; preprocessing zincate; carrying out common watt nickel plating; and plating the tin-bismuth alloy. The invention reduces the processing cost by plating a layer of the tin-bismuth alloy on the aluminum base plate, not only has good welding performance, but also has better mechanical strength at low temperature.

Description

【Technical field】 [0001] The invention belongs to the technical field of metal surface treatment, and in particular relates to a plating solution formula and preparation method for electroplating on the surface of an aluminum substrate and a method for electroplating on the aluminum substrate. 【Background technique】 [0002] Due to the outstanding advantages of small size, light weight and high reliability, microwave solid-state devices play an increasingly important role in low-power modern weaponry. With the development of microwave solid-state devices, there is an urgent need for high-quality, high-performance circuit substrates. The aluminum substrate has good thermal conductivity, which can reduce the operating temperature of the product, improve the power density and reliability of the product, and prolong the service life of the product. The surface of the aluminum substrate needs a layer of coating with strong adhesion and good solderability, usually gold-plated, si...

Claims

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Application Information

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IPC IPC(8): C25D3/60C25D5/44
Inventor 吴华夏方卫肖兵李锐李康伟马宁宁夏明
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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