Ceramic hollow sphere composite binder cubic boron nitride grinding wheel working layer and manufacturing method thereof
A cubic boron nitride and composite binder technology, which is applied in manufacturing tools, metal processing equipment, abrasives, etc., can solve the problems of poor stability of grinding quality, easy burns of workpieces, frequent dressing of grinding wheels, etc., to maintain sharp cutting edges, The effect of maintaining super wear resistance and improving support strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0029] Al 2 o 3 The particle diameter of ceramic hollow balls (provided by Zhengzhou Yuli Industrial Co., Ltd.) is 100-120 microns, and its mass accounts for 15% of the total mass of composite binder layer materials. 85% Cu-Sn-Ti alloy powder is selected (the content of Ti is 10%, the mass ratio of Cu and Sn is 2:1, and the pure powder is self-prepared), and the particle size is 20-30 microns. Will Al 2 o 3 The particles were mechanically mixed with Cu-Sn-Ti alloy powder, solid-phase sintered at a heating temperature of 600°C and a holding time of 30 minutes, and then cooled to room temperature to obtain a ceramic hollow ball composite binder. The CBN abrasive grains, 5% graphite grains, and 80% composite binder, accounting for 15% of the total mass of the working layer materials, were mechanically stirred and mixed uniformly, and then compressed into a blank with a pressure of 400MPa. Put the blank into a vacuum heating furnace, and carry out high-temperature vacuum liqui...
Embodiment 2
[0032] Al 2 o 3 The particle diameter of the ceramic hollow ball is 100-120 microns, and its mass accounts for 5% of the total mass of the composite binder layer material. 9.5% Cu-Sn-Ti alloy powder (the content of Ti is 10%, the mass ratio of Cu and Sn is 2:1) is selected, and the particle size is 20-30 microns. Will Al 2 o 3The particles were mechanically mixed with Cu-Sn-Ti alloy powder, solid-phase sintered at a heating temperature of 600°C and a holding time of 30 minutes, and then cooled to room temperature to obtain a ceramic hollow ball composite binder. The CBN abrasive grains accounting for 25% of the total mass of the working layer material, 5% graphite grains and 70% composite binder are mechanically stirred and mixed evenly, and then compressed into a blank with a pressure of 400MPa. Put the blank into a vacuum heating furnace, and carry out high-temperature vacuum liquid-phase activation sintering at a heating temperature of 880 ° C and a holding time of 30 m...
Embodiment 3
[0034] Al 2 o 3 The particle diameter of the ceramic hollow ball is 100-120 microns, and its mass accounts for 5% of the total mass of the composite binder layer material. 95% Cu-Sn-Ti alloy powder (wherein, the content of Ti is 10%, the mass ratio of Cu and Sn is 2:1) is selected, and the particle size is 20-30 microns. Will Al 2 o 3 Ceramic hollow sphere particles and Cu-Sn-Ti alloy powder were mechanically mixed and solid-phase sintered at a heating temperature of 600°C and a holding time of 30 minutes, and then cooled to room temperature to obtain a ceramic hollow sphere composite binder. 15% of CBN abrasive grains, 5% of graphite grains and 80% of composite binder, which account for the total mass of the working layer material, are mechanically stirred and mixed evenly, and then compressed into a blank with a pressure of 400MPa. Put the blank into a vacuum heating furnace, and perform high-temperature vacuum liquid-phase activation sintering at a heating temperature o...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com