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Improved double Gilbert structure radio-frequency orthogonal upper frequency mixer

A mixer and improved technology, applied in the field of radio frequency integrated circuit design, can solve the problem that the linearity cannot reach the ideal value, etc., and achieve the effects of small noise figure, reduced current, and improved linearity

Inactive Publication Date: 2011-02-02
EAST CHINA NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual RF transmitter application, if the gain of the up-mixer is high enough, the pressure on the lower power amplifier can be greatly reduced, but when the gain of the up-mixer is high, the linearity usually cannot reach the ideal value case

Method used

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  • Improved double Gilbert structure radio-frequency orthogonal upper frequency mixer
  • Improved double Gilbert structure radio-frequency orthogonal upper frequency mixer
  • Improved double Gilbert structure radio-frequency orthogonal upper frequency mixer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0021] This embodiment has the same figure 2 , 3 and Figure 4 The circuit shown is exactly the same circuit structure. All device dimensions of the entire design of this embodiment are shown in Table 1.

[0022] Table 1 Summary of Device Dimensions

[0023] device name

size

device name

size

Q1

200nm×10um×8

R2

50ohms

Q2

200nm×10um×8

R3

2k ohms

Q3

200nm×10um×8

R4

2k ohms

Q4

200nm×10um×8

R5

2k ohms

Q5

200nm×10um×8

R6

2k ohms

Q6

200nm×10um×8

R7

2k ohms

[0024] Q7

200nm×10um×8

R8

2k ohms

Q8

200nm×10um×8

R9

200ohms

Q9

200nm×10um×8

R10

200ohms

Q10

200nm×10um×8

R11

200ohms

Q11

200nm×10um×8

R12

200ohms

Q12

200nm×10um×8

R13

2k ohms

Q13

200nm×10um×8

R14

2k ohms

Q14

200nm×1...

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PUM

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Abstract

The invention discloses an improved double Gilbert structure radio-frequency orthogonal upper frequency mixer. The frequency mixer comprises a transconductance level circuit, a switching level circuit and a tail current source circuit. Silicon germanium double pole-complementary metal oxide semiconductor process technology is adopted in the integral circuit; and the frequency mixer combines the advantages of a bipolar device and a complementary metal oxide semiconductor, and can improve the conversion gain at the same time of effectively reducing circuit noise. The transconductance level circuit has a parallel-connection structure of three pairs of transconductances, and improves the linearity of the frequency mixer at the same time of increasing the transconductance parameter of the transconductance level. The switching level circuit works in an ideal switching state according to the simulation result. A current injection mode is also adopted in the circuit, and partial current is extracted at the emitter of the switching level so that the current of the switching level is low enough and the hot noise and the flicker noise of the circuit are effectively reduced. According to the design, the frequency mixer works at 1.95GHz and can be applied in personal communication service and wideband code division multiple access communication systems.

Description

technical field [0001] The invention belongs to the technical field of radio frequency integrated circuit design, specifically a silicon germanium bipolar-complementary metal oxide semiconductor (SiGe BiCMOS) improved dual-Gilbert structure radio frequency quadrature up-mixer working at 1.95 GHz . Background technique [0002] In recent years, with the popularization of the Internet, wireless communications such as wireless LAN, Bluetooth, and CDMA have developed rapidly, and the monolithic integration of RF transceivers in CMOS technology has long been a hot spot for development. And now the ever-increasing low power consumption, low noise and low cost have put forward higher standards for wireless communication design. Using SiGe BiCMOS process to design and fabricate radio frequency chip (RFIC) is one of the research hotspots in today's international integrated circuits. Researchers from different countries and regions have done a lot on silicon germanium radio frequency...

Claims

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Application Information

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IPC IPC(8): H03D7/12
Inventor 张伟陈磊赖宗声华林刘盛富张书霖苏杰阮颖
Owner EAST CHINA NORMAL UNIVERSITY
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