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Ultraviolet curing adhesive for bonding silicon rubber with plastics

A technology of ultraviolet light and silicone rubber, used in adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc., can solve the problems of long curing time, high energy consumption and limited operating time. , to achieve the effect of improving yield and reducing energy consumption

Active Publication Date: 2011-02-02
东莞市贝特利新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its biggest disadvantage is that the curing time is long, it takes more than 60 minutes, the energy consumption is large (baking temperature 90 ℃), and it is a two-component form, and the operating time is limited (generally 4 hours).

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Composed of the following raw materials in weight percent:

[0058] Urethane Acrylate 50%

[0059] Phenoxyethyl Acrylate 25%

[0060] Hexylene Glycol Diacrylate 20%

[0061] 1-Hydroxycyclohexylphenyl ketone 3%

[0062] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide 1.5%

[0063] γ-(Methacryloyloxy)propyltrimethoxysilane 0.5%

Embodiment 2

[0065] Composed of the following raw materials in weight percent:

[0066] Epoxy Acrylate 45%

[0067] Phenoxyethyl Acrylate 20%

[0068] Tripropylene Glycol Diacrylate 30%

[0069] 1-Hydroxycyclohexylphenyl ketone 3%

[0070] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide 1.5%

[0071] γ-(Methacryloyloxy)propyltrimethoxysilane 0.5%

Embodiment 3

[0073] Composed of the following raw materials in weight percent:

[0074] Epoxy Acrylate 35%

[0075] Polyester Acrylate 15%

[0076] Phenoxyethyl Acrylate 20%

[0077] Tripropylene Glycol Diacrylate 20%

[0078] Isobornyl Acrylate 5%

[0079] 1-Hydroxycyclohexylphenyl ketone 3%

[0080] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide 1.5%

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PUM

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Abstract

The invention discloses an ultraviolet curing adhesive, in particular an ultraviolet curing adhesive for bonding silicon rubber with plastics and in especial relates to an ultraviolet curing adhesive for bonding a silicon rubber substrate for mobile phone keys with plastic keycaps. The ultraviolet curing adhesive comprises the following raw materials in parts by weight of a low polymer, an activated monomer, a photoinitiator and an additive and has the characteristics of quick curing, convenient operation, high production efficiency and stable and reliable bonding property in high-temperature and high-humidity environment.

Description

technical field [0001] The invention relates to an adhesive, in particular to an ultraviolet curing adhesive used for bonding silicon rubber and plastics. Background technique [0002] Due to its good mechanical properties, excellent weather resistance and stability in high and low temperature environments, silicone rubber has been widely used in the manufacture of electronic products. With the development of mobile phones and office electronic products in the late 1990s With the explosive growth and rapid popularization around the world, button products have formed a large-scale industry, especially mobile phone buttons. With the development of technology, the performance and efficiency of mobile phones are continuously improved, the appearance design is constantly updated, and the requirements for buttons are also constantly updated. From the early days to the beginning of this century, the keys of mobile phones were mainly made of pure silicone rubber; in recent years, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J11/06
Inventor 官灏曾建伟陶林华
Owner 东莞市贝特利新材料有限公司
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