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Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate

A FR-4, surface treatment technology, applied in metal material coating process, secondary treatment of printed circuit, improvement of metal adhesion of insulating substrate, etc., can solve the problem of inability to meet environmental protection color requirements and large difference in internal performance of copper foil and other problems, to achieve excellent anti-plating diffusion performance, excellent resistance to normal temperature, improved appearance characteristics and corrosion resistance

Active Publication Date: 2011-01-05
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the copper foil manufacturers in China are still far behind foreign copper foils in terms of internal performance of copper foils, and they still cannot meet environmental protection and specific color requirements at room temperature and high temperature.

Method used

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  • Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate
  • Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate
  • Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The surface treatment process of red copper foil for high-grade FR-4 copper clad laminates, the specific steps are as follows:

[0034] 1. Coarsening: mix and dissolve cathode copper, concentrated sulfuric acid, soft water, and steam to form copper sulfate solution, then add additive A, mix well, pump it into the roughening tank for electroplating; among them, Cu 2+ 10g / L,H 2 SO 4 80g / L, the additive A is gum arabic, the concentration is 8.5ppm, the temperature is 25°C, and the current density is 20A / dm 2 .

[0035] 2. Curing: Mix and dissolve cathode copper, concentrated sulfuric acid, soft water, and steam to generate a copper sulfate solution, which is pumped into the curing tank for electroplating; where Cu 2+ 50g / L, H 2 SO 4 80g / L, temperature is 35℃, current density is 20A / dm 2 .

[0036] 3. Copper-nitrogen alloy: mix and dissolve cathode copper, concentrated sulfuric acid, soft water, and steam to form a copper sulfate solution, then add additive T, mix...

Embodiment 2

[0042] The difference between this embodiment and embodiment 1 is that

[0043] 1. Coarsening: Cu 2+ 30g / L, H 2 SO 4 200g / L, temperature is 50℃, current density is 35A / dm 2 , Additive A selects hydroxyethyl cellulose with a concentration of 5.4ppm.

[0044] 2. Curing: Cu 2+ 100g / L,H 2 SO 4 200g / L, temperature is 55℃, current density is 35A / dm 2 .

[0045] 3. Copper-nitrogen alloy: Cu 2+ 20g / L, H 2 SO 4 200g / L, temperature is 50℃, current density is 20A / dm 2 , Additive T 500ppm, additive T selects acridine orange for use.

[0046] 4. Galvanized: K 4 P 2 o 7 300g / L, Zn 2+ 10g / L, PH 11, temperature 50℃, current density 1.5A / dm 2 , Additive M is tartaric acid, the concentration is 2.3g / L.

[0047] 5. Passivation: potassium chromate 10g / L, pH 12, temperature 50°C, current density 8.0A / dm 2 .

[0048] 6. Coupling agent spraying: silane coupling agent volume percentage concentration 5%, temperature 40°C.

Embodiment 3

[0050] The difference between this embodiment and embodiment 1 is that

[0051] 1. Coarsening: Cu 2+ 20g / L, H 2 SO 4 140g / L, temperature is 40℃, current density is 30A / dm 2 , Additive A is selected from propenyl thiourea, the concentration is 2.0ppm.

[0052] 2. Curing: Cu 2+ 75g / L, H 2 SO 4 140g / L, temperature is 45°C, current density is 27A / dm 2 .

[0053] 3. Copper-nitrogen alloy: Cu 2+ 13g / L,H 2 SO 4 140g / L, temperature is 40℃, current density is 11A / dm 2 , Additive T 255PPM, additive T selects the mixture of phenazine and 5-hydroxymethyl pyrimidine according to mass ratio 2:1.

[0054] 4. Galvanized: K 4 P 2 o 7 220g / L, Zn 2+ 6g / L, PH 10, temperature 35℃, current density 1A / dm 2 , Additive M is sodium dihydrogen phosphate, the concentration is 8.2g / L.

[0055] 5. Passivation: Potassium chromate 6g / L, pH 10, temperature 40°C, current density 5.0A / dm 2 .

[0056] 6. Coupling agent spraying: silane coupling agent volume percentage concentration 2....

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Abstract

The invention relates to a surface treatment process of reddened copper foil for a high-grade FR-4 copper-clad plate, belonging to the field of a copper foil production process. The surface treatment process of the reddened copper foil for the high-grade FR-4 copper-clad plate is characterized by comprising the following steps: taking 12-70mu m high-temperature high-extensibility copper foil as a cathode, operating at a rate of 25.0+ / -0.1m / min, carrying out coarsening and solidifying fractal electro-deposition of tuberculiform metallic copper on the surface of the copper foil; electrodepositing a nano-level copper alloy layer, wherein the copper alloy can be observed that the crystal is in a punctiform shape by utilizing an electron scanning microscope, and the crystal belongs to whisker; and electrodepositing a nano-level zinc layer; and finally carrying out alkaline chromating, and coating a layer of silane coupling agent. In the process of electrodepositing a nano-level punctiform whisker copper-nitrogen alloy layer, the invention adopts nitrogen-containing heterocyclic ring organic addition agent to improve the appearance characteristic and the corrosion resistance after surface treatment. The reddened copper foil in the invention has the advantages of favorable normal temperature resistance, high-temperature oxydation performance, plating diffusion resistance, corrosion and etching resistance, favorable peeling resistance and high-temperature conversion resistance.

Description

technical field [0001] The invention relates to a surface treatment process of reddish copper foil for high-grade FR-4 copper-clad laminates, and belongs to the technical field of production process of high-precision electronic copper foil. Background technique [0002] Electronic copper foil is one of the main basic materials of printed circuit boards and is widely used in electrical products. my country is a big producer of electronic copper foil, but there is still a big gap in production technology compared with developed countries, especially high-end products have been occupied by Japan and the United States. In the field of electronic copper foil for high-grade FR-4 copper-clad laminates, in addition to requiring copper foil to have excellent intrinsic properties and environmental friendliness, manufacturers of high-grade copper-clad laminates have also formed an inherent color requirement. At present, most of the copper foil manufacturers in China are still far behi...

Claims

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Application Information

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IPC IPC(8): C23C28/00C25D5/10C25D5/34C25D5/48C25D7/06H05K3/38
Inventor 徐树民刘建广杨祥魁马学武宋召霞
Owner SHANDONG JINBAO ELECTRONICS
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