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Curable resin composition and cured product

A curable resin and composition technology, applied in the field of cured products, can solve the problems of excellent formability, yellowing, heat discoloration resistance, and low shrinkage, and achieve low thermal expansion, high transparency, and high heat discoloration resistance Effect

Active Publication Date: 2010-10-13
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, even if a cured product with excellent heat resistance and heat discoloration resistance can be obtained from a composition containing a silicone resin, curing shrinkage occurs during the production of the cured product, and there is a problem of reproducibility in obtaining the cured product
On the other hand, compositions containing epoxy resins have low shrinkage and excellent formability during curing, but there is a problem that antimony-based curing catalysts used together cause heat discoloration such as yellowing at high temperatures.
These problems cannot be completely solved by using the various compositions reported in the past

Method used

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  • Curable resin composition and cured product
  • Curable resin composition and cured product
  • Curable resin composition and cured product

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0069] In a reaction vessel equipped with a stirrer, a dropping funnel, and a thermometer, 14.3 g of tetramethylammonium hydroxide pentahydrate (manufactured by Kanto Chemical Industry Co., Ltd.) was added as a basic catalyst, dissolved in 17.0 g of water, and then 189 mL of toluene and 2 - Propanol 95 mL. 46.8 g of vinyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.: KBM1003) was added to the dropping funnel, and vinyltrimethoxysilane was added dropwise at room temperature over 3 hours while stirring the reaction vessel. After completion of the dropwise addition, the mixture was stirred at room temperature for 2 hours. After the stirring was finished, the stirring was stopped and left to stand still for 1 day. Then, the reaction solution was neutralized with 82.9 g of 10% citric acid aqueous solution. The aqueous layer was extracted with toluene, and the organic layer was washed 3 times with distilled water. The organic layer was dried over anhydrous magnes...

Synthetic example 2

[0082] In a reaction container equipped with a stirrer, a dropping funnel, and a thermometer, 14.3 g of tetramethylammonium hydroxide pentahydrate was added as a basic catalyst, dissolved in 17 g of water, and then 189 mL of toluene and 95 mL of 2-propanol were added. Put 23.4 g of vinyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.: KBM1003) and 23.7 g of ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.: LS-890) into the dropping funnel, and stir the reaction vessel , A mixture of vinyltrimethoxysilane and ethyltrimethoxysilane was added dropwise at room temperature over 3 hours. After completion of the dropwise addition, the mixture was stirred at room temperature for 2 hours. After the stirring was finished, the stirring was stopped and left to stand still for 1 day. Next, the reaction vessel was provided with a Dean and Stark moisture meter and a condenser, 95 mL of toluene was added, and 2-propanol and methanol generated during hydrolys...

Synthetic example 3

[0090] In a reaction container equipped with a stirrer, a dropping funnel, and a thermometer, 14.3 g of tetramethylammonium hydroxide pentahydrate was added as a basic catalyst, dissolved in 17 g of water, and then 189 mL of toluene and 95 mL of 2-propanol were added. 78.4 g of 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.: LS-3380) was added to the dropping funnel, and 3-methoxysilane was added dropwise at room temperature over 3 hours while stirring the reaction vessel. Methacryloxypropyltrimethoxysilane. After completion of the dropwise addition, the mixture was stirred at room temperature for 2 hours. After the stirring was finished, the stirring was stopped and left to stand still for 1 day. Next, the reaction vessel was equipped with a Dean and Stark moisture meter and a condenser, 95 mL of toluene was added, and 2-propanol and methanol generated during hydrolysis were removed with an oil bath at 90°C. Then, the temperature of the o...

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Abstract

The present invention relates to a curable resin composition and a cured product. The curable resin composition has excellent reproductivity of curing and processing characteristic in manufacturing process of cured product, can obtain the cured product with stable quality and has low curing shrinkage characteristic. Furthermore the cured product with heat discoloring resistance, low heat expansibility and high transparency can be obtained. The curable resin composition is characterized by comprising the following components as essential components: (A) organic-inorganic compound which comprises more than two aliphatic unsaturated bonds and is composed of cage type siloxane and organic components; (B) olefinic unsaturated compound with at least two (methyl)acryloyls, and (C) solid catalyst, wherein relatively to 100 parts by weight of total amount of (A), (B) and (C), the content of component (A) which uses the organic-inorganic compound as the main component is at least 30 parts by weight.

Description

technical field [0001] The present invention relates to a curable resin composition and a cured product. Specifically, it relates to a curable resin composition that can obtain cured products useful as optical materials for optical applications, optical device applications, display device applications, etc., mechanical component materials, electric-electronic component materials, and the like, and products obtained by using the same. Cured. Background technique [0002] Molding materials such as machine parts materials, electric-electronic parts materials, automobile parts materials, civil engineering and construction materials, etc., are widely used by curing resins. A resin composition in which the resin is used as a binder. By adding inorganic substances to these curable resin compositions, the thermal expansion coefficient of the cured product can be reduced, and heat resistance and transparency can also be improved. Therefore, in recent years, especially in electronic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K5/103
CPCC08F283/12C08G77/20C08K5/5415C08L51/085C08L83/10
Inventor 河谷俊宏平贺范之汤浅正敏
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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