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Encapsulating method of large power reactor

A packaging method and reactor technology, applied in the direction of inductance/transformer/magnet manufacturing, circuits, electrical components, etc., can solve problems such as uneven strength, poor impact resistance, cracking, etc., and achieve low internal stress, good fluidity, and energy saving The effect of manufacturing hours

Inactive Publication Date: 2010-09-29
INDUCTOTHERM GROUP CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The purpose of the present invention is to provide a packaging method for high-power reactors in response to the above problems. The packaging method successfully uses polyurethane for the packaging of high-power reactors, and utilizes the excellent impact resistance, water resistance, and water resistance of polyurethane packaging materials. Thermal and stable electrical properties, overcome the shortcomings of traditional packaging materials epoxy resin is brittle, poor impact resistance, uneven strength at high temperature and cracking at low temperature

Method used

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  • Encapsulating method of large power reactor

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with embodiment:

[0017] The polyurethane general characteristic that present embodiment adopts is as follows:

[0018]

[0019] The curing characteristics are as follows:

[0020] project

[0021] The packaging method steps of the present invention are as follows:

[0022] A. Pretreatment: preheat polyurethane material A and material B at 20-30°C, mix them according to the weight ratio of 1:4, and perform defoaming treatment for 150-210 seconds.

[0023] B. Pouring and encapsulation: Pouring the above-mentioned pretreated polyurethane on the coil and the mold, the temperature at the casting site is 20-26°C, the humidity is ≤65%, and it solidifies at room temperature for 6-10 hours after completion, the complete curing time of polyurethane and the product The hardness will vary due to the difference in ambient temperature. The curing time at room temperature is about 120 hours, and the ...

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Abstract

The invention relates to an encapsulating method of a large power reactor, which is characterized in that polyurethane encapsulating material is used for pouring a device to be encapsulated. The encapsulating method is mainly suitable for heating and filling air gaps in a multi-conductor wire and cable core or gaps between cable elements with any structure. The polyurethane encapsulating material not only has favorable insulation performance, mechanics property and chemical property of the epoxy resin, but also overcomes the weakness that the epoxy resin is fragile, has poor impact resistance and non-uniform strength at the high temperature and the epoxy resin is fractured at the low temperature; and at the same time, the polyurethane encapsulating material is toxic-free and resists the fire, and is free from containing the composition which is harmful to the human body and the environment.

Description

technical field [0001] The invention relates to a packaging method for a high-power reactor. Background technique [0002] At present, epoxy resin is used to cast insulating structural materials such as high-power reactors, power transformers, transformers, and insulating parts in high-voltage and high-current switches. Epoxy resin (Epoxy Resin) refers to organic polymer compounds containing two or more epoxy groups in the molecule. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble, infusible high polymers with a three-dimensional network structure. Since 1958, my country has conducted research on epoxy resin and put it into industrial production at a very fast speed. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/00B29C39/00
Inventor 陈鹰张源泉
Owner INDUCTOTHERM GROUP CHINA
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