Metal substrate and light-emitting diode encapsulation method of metal substrate

Abstract

The invention discloses a metal substrate and a light-emitting diode (LED) encapsulation method of the metal substrate. The encapsulation method comprises the following steps: stamping a lens installation slot, a fluorescent powder coating slot and an electrode pad on the metal substrate, forming an insulating layer on the substrate, adopting the silk screen printing method to form a eutectic solder pad, a reflecting metal layer, a lead and a metal solder pad; then performing eutectic welding of a chip on the metal substrate; adding fluorescent powder, sending the metal substrate in an oven to solidify fluorescent powder; installing a lens, injecting adhesive, sending the metal substrate in the oven for solidifying; and cutting the circuit board to obtain a high power LED encapsulated by the substrate. The invention provides the metal substrate and the LED encapsulation method of the metal substrate; and the encapsulation technology of the metal substrate adopts the stamping technology and the silk screen printing technology so that the accuracy of patterns on the substrate can be ensured and the material cost can be saved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a metal substrate and an LED packaging method of the metal substrate. Background technique [0002] Power-type light-emitting diodes (Light Emitting Diode, LED) are considered to be the most potential semiconductor devices to replace various existing lighting sources. Currently, there are two types of power packages on the market: stand-off type and substrate type. There are Luxeon series launched by Lumileds Company, Dragon series launched by Osram Company and Xlamp series launched by Cree Company. Many domestic packaging manufacturers imitate their appearance. The advantage of bracket type packaging is that the structure of the device is stable, the process is easy to mass produce, and it is suitable for eutectic soldering, phosphor colloid, and lens molding. However, its outstanding disadvantage is that there are more intermediate heat sinks and heat dissi...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a metal substrate, which can solve technical problems such as low light extraction efficiency, poor white light color performance, and poor heat dissipation of traditional metal substrate high-power LED packages.

[0007] In addition, the present invention provides a metal substrate LED packaging method, which can solve technical problems such as low light extraction efficiency, poor white light color performance, and poor heat dissipation in traditional metal substrate high-power LED packaging.

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