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Integrated chip type oxygen sensor and manufacturing method thereof

An oxygen sensor and integrated chip technology, which is applied in the field of integrated chips for zirconia sensors, can solve the problems of many processes, complex structure, etc., and achieves the effects of simple preparation process, small size and good stability

Active Publication Date: 2010-08-18
CHANGZHOU LAMBDA ELECTRONICS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] In order to overcome the shortcomings of the existing oxygen sensor with complex structure and many processes, the present invention provides an integrated chip oxygen sensor and its manufacturing method

Method used

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  • Integrated chip type oxygen sensor and manufacturing method thereof
  • Integrated chip type oxygen sensor and manufacturing method thereof
  • Integrated chip type oxygen sensor and manufacturing method thereof

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Embodiment

[0037] Combination and decomposition below image 3 The fabrication process of the oxygen sensor of the present invention is described in detail.

[0038] In the first step, the zirconia powder of 5% mole yttrium oxide is mixed with PVB, terpineol and dibutyl phthalate (DBP) with a mass ratio of 80:10:5:5 to prepare a slurry by ball milling, and then pass Tape casting with double-knife-edge technology, after natural drying, make a zirconia green strip, and then punch it into a substrate green body, that is, the upper zirconia substrate 11; then mix the electrode slurry containing 70% to 90% platinum powder and The conductive paste is printed on the inner and outer surfaces of the upper zirconia substrate 11 to form the measuring electrode 12 and the reference electrode 13; the electrodes on the inner surface are connected to the inner electrode connecting piece on the outer surface through the electrode connection through hole 20 punched and formed at the end of the upper zirc...

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Abstract

The invention relates to the technical field of integrated chips used for zirconium oxide sensors, in particular to an integrated chip type oxygen sensor and a manufacturing method thereof. The integrated chip type oxygen sensor comprises a zirconium oxide substrate, wherein the zirconium oxide substrate consists of an upper layer of zirconium oxide substrate and a lower layer of zirconium oxide substrate; an external surface of the upper layer of zirconium oxide substrate is provided with a measuring electrode, and an internal surface of the upper layer of zirconium oxide substrate is provided with a reference electrode and a long and narrow gap; an internal surface of the lower layer of zirconium oxide substrate directly contacts the long and narrow gap, and an alumina ceramic insulating layer is coated on an external surface of the lower layer of zirconium oxide substrate; the alumina ceramic insulating layer is directly integrated with a platinum heating element; a heating electrode plate and the platinum heating element are directly connected together on the external surface of the zirconium oxide substrate; and the outermost layer of the zirconium oxide substrate is provided with a porous ceramic protective layer. The integrated chip type oxygen sensor provided by the invention is only provided with two layers of zirconium oxide substrates and integrated with the heating elements, and has the advantages of thin thickness, and simple preparation method, high production efficiency and high stability.

Description

technical field [0001] The invention relates to the technical field of integrated chips for zirconia sensors, in particular to an integrated chip oxygen sensor and a manufacturing method thereof. Background technique [0002] With the improvement of automobile emission regulations, the requirements for exhaust emission control are also getting higher and higher. For this reason, automobile engines need a shorter cold start time to meet the requirements. At the same time, considering the needs of energy saving, a chip oxygen sensor with high integration, small size, low power consumption and fast start-up speed has become a trend to meet the requirements of the engine EFI system to enter closed-loop control as quickly as possible after cold start , while reducing the power consumption of the oxygen sensor. [0003] The existing chip sensor structures are as follows: figure 1 (a), (b) and (c). The structure is mainly composed of three layers of zirconia substrate and severa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/409
Inventor 冯江涛杨世养党桂彬
Owner CHANGZHOU LAMBDA ELECTRONICS
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