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High heat conductivity aluminum-diamond diphase continuous composite material preparation method

A two-phase continuous, high thermal conductivity technology, which is applied in the field of powder metallurgy process to prepare high thermal conductivity aluminum-diamond dual-phase continuous composite materials, can solve the problems of high cost, achieve high density, improve heat conduction and heat dissipation functions, and phase stable effect

Inactive Publication Date: 2010-07-28
UNIV OF SCI & TECH BEIJING
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

but its cost is too high

Method used

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Effect test

Embodiment 1

[0021] Select aluminum foil and diamond particles as raw materials, evenly sprinkle diamond particles on the aluminum foil, roll it into a cylindrical shape, and form a layered structure of aluminum and diamond. Cold isostatic pressing was carried out on the finished green body with a pressure of 120MPa; discharge plasma sintering was carried out on the cold isostatic pressed green body. For surface preparation.

[0022] The aluminum-diamond composite material prepared by the above process has high density, the diamond particles are in continuous contact in the axial direction, the structure is uniform, the phase is stable, and the thermal conductivity in the direction of the continuous contact of the diamond particles is excellent, and the thermal conductivity in this direction is the direction perpendicular to it. More than 3 times the thermal conductivity. And higher than pure aluminum material. Its cost is low compared to other methods.

Embodiment 2

[0024] Select aluminum foil and diamond particles as raw materials, evenly sprinkle diamond particles on the aluminum foil, cut the aluminum foil coated with diamond into discs, and laminate them to form a layered structure of aluminum and diamond. Carry out rigid mold pressing treatment to the produced cylindrical green body. Hot pressing is carried out on the green body which has been processed by rigid mold pressing. The process parameters are: temperature 630°C, pressure 35MPa, holding time 7min, and finally surface treatment.

[0025] The aluminum-diamond composite material prepared by the above process has high density (relative density 100%), the diamond particles are in continuous contact in the transverse direction, the structure is uniform, the phase is stable, and the thermal conductivity in the direction of continuous contact of the diamond particles is excellent. The thermal conductivity is more than 2.8 times that of the thermal conductivity in the vertical direc...

Embodiment 3

[0027] Select aluminum foil and diamond particles as raw materials, evenly sprinkle diamond particles on the aluminum foil, roll it into a cylindrical shape, and form a layered structure of aluminum and diamond. Cold isostatic pressing is carried out on the finished body with a pressure of 200MPa; discharge plasma sintering is carried out on the green body after cold isostatic pressing. The sintering process is: sintering temperature 600°C, pressure 35MPa, holding time 4 minutes, Finish with surface treatment.

[0028] The aluminum-diamond composite material prepared by the above process has high density, the diamond particles are in continuous contact in the axial direction, the structure is uniform, the phase is stable, and the thermal conductivity in the direction of the continuous contact of the diamond particles is excellent, and the thermal conductivity in this direction is the direction perpendicular to it. More than 3 times the thermal conductivity. And higher than pu...

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Abstract

The invention discloses a high heat conductivity aluminum-diamond diphase continuous composite material preparation method which includes that: diamond particles and aluminum are regularly arranged to lead the diamond particles to be in a continuous contact state in heat conduction direction; the arranged blanks receive densification treatment; and the blanks after densification treatment are sintered. The densification treatment includes cold isostatic pressing, flexible mold pressing, steel mold pressing, rolling and squeezing. The sintering treatment includes protective atmosphere sintering, vacuum sintering, hot pressing, hot isostatic pressing and spark plasma sintering. The invention has advantages that: the composite material prepared by the preparation method has higher density, uniform structure, stable phase and high heat conductivity. The coefficient of heat conductivity in diamond continuous contact direction is three times of the coefficients in other directions. The invention initiatively adopts aluminum and diamond to prepare diphase continuous composite material, reduces the cost and improves the performance of heat conductive material. The invention not only brings innovative significance to prepare heat conductive materials, but also promotes the theory and practice in the composite material field.

Description

technical field [0001] The invention provides a powder metallurgy process, in particular to a method for preparing a high thermal conductivity aluminum-diamond dual-phase continuous composite material, which belongs to the field of preparation of new thermal conductivity composite materials. Background technique [0002] A large number of electronic products and mechanical equipment are used in industrial production and people's daily life, which greatly improves production efficiency and people's living standards. However, the deficiencies in the heat conduction and heat dissipation functions of various equipment are also exposed, resulting in waste of energy and low equipment utilization. In order to better improve the utilization rate of energy and equipment, and solve the problem of enhancing and slowing down heat transfer, the research and preparation of various materials with high thermal conductivity are particularly important. At present, foreign research in this fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C21/00
Inventor 贾成厂郭静孙久姗孙璐
Owner UNIV OF SCI & TECH BEIJING
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