Soluble and high-temperature resistant aromatic polyimide and preparation method thereof

Abstract

The invention discloses soluble and high-temperature resistant aromatic polyimide and a preparation method thereof. The preparation method comprises the following steps: stirring a 2,2'-R,R-4,4'-diaminodiphenyl compound and a 2,2'-R,R-4,4',5,5'-diphenyltetracarboxylic dianhydride compound in molar ratio of 1 to 1 in a strongly polar non-proton organic solvent at the room temperature to obtain homogeneous-phase, transparent and viscous polyimide solution; and dehydrating the polyimide solution to obtain the soluble and high-temperature resistant aromatic polyimide. The soluble and high-temperature resistant aromatic polyimide has the polyimide of the repetitive unit of a general formula [1] that number average molecular weight Mn is equal to 8,000 to 20,000; molecular weight distribution Mw / Mn is equal to 1.2 to 1.7; and R is a group in the 2,2'-R,R-4,4'-diaminodiphenyl compound, and R' is a group in the 2,2'-R,R-4,4',5,5'-diphenyltetracarboxylic dianhydride compound. The aromatic polyimide is soluble in the high-temperature or chemical dehydration full ring closure of weakly polar solvents.

Description

technical field The invention belongs to the synthesis technology of aromatic polyimide, in particular to a soluble high-temperature-resistant aromatic polyimide and a preparation method thereof. Background technique Polyimide is a kind of polymer with excellent comprehensive performance, which has excellent heat resistance, low temperature resistance, self-lubrication, radiation resistance and flame retardancy, as well as excellent mechanical properties and dielectric properties . Therefore, it is widely used in high-temperature radiation-resistant materials such as spacecraft, satellites, and space vehicles; advanced structural composite materials, electrical insulation materials, high-temperature-resistant adhesives, and high-temperature-resistant sealing materials in aerospace, automobiles, electromechanical, etc. In the field of microelectronics, it can be used as the base material of FPC or PCB, the interlayer insulation material of IC, the passivation coating of very...

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Problems solved by technology

The disadvantage of this method is that due to the use of a large amount of aliphatic diamines, the heat resistance of the adhesive system is greatly reduced, and its glass transition temperature is 150-200 ° C, which limits the use of printed circuit boards in high-temperature environments. use in

Its main disadvantage is that it needs long-term high-temperature curing at a high temperature of 350°C

This not only consumes energy, puts forward higher technical requirements for equipment, but also easily oxidizes copper foil

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