Method for photoetching piezoelectric film transducers on two sides of acoustic bulk wave
A technology of piezoelectric film and double-sided lithography, applied in piezoelectric/electrostrictive/magnetostrictive devices, microlithography exposure equipment, circuits, etc., can solve the problem of low product yield, poor positioning accuracy, sound body Wave microwave delay line insertion loss and poor third-order suppression, to achieve the effect of high collimation accuracy and large size range
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[0017] The double-sided lithography manufacturing method of the bulk acoustic wave piezoelectric film transducer of the present invention comprises the following steps:
[0018] 1) According to the designed electrode pattern of each layer of the bottom electrode, the piezoelectric film and the upper electrode, make a double-sided photolithography mask for the bottom electrode, a piezoelectric film for overlaying, and a mask for the upper electrode. The bottom electrode mask is two pieces with the same pattern, which are mirror images of each other, and there are alignment marks on the bottom electrode mask to realize the alignment of the two plates;
[0019] 2) Form the bottom electrode metal film at both ends of the sound transmission medium by evaporation or sputtering;
[0020] 3) Double-sided photolithography of the bottom electrode pattern on the bottom electrode metal film at both ends of the sound transmission medium through the two bottom electrode masks;
[0021] 4) ...
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