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Phosphor powder film making method and obtained phosphor powder film encapsulating method

The technology of a phosphor film and a manufacturing method, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, electrical solid-state devices, etc., can solve the problems that phosphor coating is difficult to accurately control heat dissipation, light efficiency, light decay, light color, etc. Achieve the effect of improving the uniformity of light output, light output efficiency, strong repeatability, and reducing chip temperature

Inactive Publication Date: 2010-04-28
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the difficulty of accurate control of phosphor coating and the problems of heat dissipation, light efficiency, light decay and light color that are common in high-power white LED packaging

Method used

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  • Phosphor powder film making method and obtained phosphor powder film encapsulating method
  • Phosphor powder film making method and obtained phosphor powder film encapsulating method
  • Phosphor powder film making method and obtained phosphor powder film encapsulating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 As shown, first mix, stir, and vacuum the phosphor and silica gel in a certain proportion; then drop the phosphor glue onto the mold fixed on the suction cup of the plastic machine; then let the plastic machine start to rotate at a certain speed , so that the phosphor glue is evenly coated on the mold to obtain a phosphor glue layer with a certain thickness; then heat curing (or light curing); and then the cured phosphor film layer is separated from the mold to obtain a whole phosphor Film layer; finally, the entire phosphor film layer is cut into a shape and size suitable for the actual packaging, and the production of the phosphor film layer is completed.

Embodiment 2

[0026] Such as figure 2 As shown, the operation is similar to that of Example 1. After the curing of one layer of phosphor film is completed, glue is dispensed, rotated, and cured again on the cured phosphor layer, and the operation is repeated, and finally demoulding and cutting . This method can make multi-layer phosphor film layers. By selecting the type of silica gel to be cured each time, a phosphor film layer with a gradient refractive index can be made to improve light extraction efficiency; it is also possible to make a multi-layer phosphor film layer of different phosphors by changing the type of phosphor powder in each ratio , so as to improve the quality of LED light, such as color rendering, color temperature, etc.

Embodiment 3

[0028] Such as image 3 As shown, the surface of the phosphor film layer may have certain microstructures, such as microlens arrays, roughening of the phosphor surface, and the like. Firstly, the fine structure is made on the surface of the mold, and then glue dispensing, spinning, curing, demoulding and cutting are carried out on the mold, and finally the phosphor film layer with the fine structure on the surface can be obtained. By adopting the microlens array, the uniformity of light output of the LED and the light output efficiency of the LED can be improved.

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Abstract

The invention discloses a phosphor powder film making method and obtained phosphor powder film encapsulating method. The invention is characterized in that a method spinning phosphor powder glue is adopted to independently make phosphor powder film in encapsulating process, then the phosphor powder film is covered on an LED chip coated with heat insulating material, and finally the heat insulating material is cured to complete white-light LED phosphor powder coating. The quantity of LED chip is one or more than one. The invention is simple in technology and low in making cost, can accurately control the thickness of phosphor powder film, greatly improves light color consistency of LED product, is applicable to large scale industrialized production and adopts heat insulating encapsulating manner to solve heat dissipation problem of LED and reduce lumens depreciation, so that light color is more stable.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation, in particular to a method for manufacturing a phosphor film layer and a method for encapsulating the obtained phosphor film layer. Background technique [0002] LED is a semiconductor light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has a series of characteristics such as low operating voltage, low power consumption, high luminous efficiency, light weight, and small size. Applied to indicator lights, display screens, etc. With the rapid development of high-power LEDs, white LEDs have gradually entered the field of general lighting, known as the fourth generation of lighting sources. In addition to RGB combination to form white light LED, there is also a way for blue or ultraviolet light chips to excite phosphor powder. The light emitted by the chip under the action of electricity partially excites phosphor powder to produce lon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/44H01L33/50H01L21/56
CPCH01L2224/48091H01L2924/00014
Inventor 张佰君蚁泽纯凌敏捷吴昊冼钰伦
Owner SUN YAT SEN UNIV
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