Plastic composition and surface selective metallization process thereof

Abstract

The invention provides a plastic composition and a surface selective metallization process thereof. The plastic composition comprises a high molecular polymer and a photocatalyst, wherein the mass ratio of the polymer to the photocatalyst is 1 to 100. The surface selective metallization process of the plastic composition comprises the following steps: performing laser etching on the surface of theplastic composition; putting the plastic composition after the laser etching into an aqueous solution containing a metal ion salt and a cavity sacrificial agent to perform photocatalysis reduction reaction so as to obtain a plastic composition with nanometer metal particles on the surface; and finally performing metal chemical plating. By adopting the plastic composition and the surface selectivemetallization process of the plastic composition, the bonding force of a plating layer and the chemical plating precision are very high.

Description

【Technical field】 [0001] The invention relates to a plastic composition and its surface selective metallization process. 【Background technique】 [0002] The circuit preparation of the traditional electronics industry and information industry mainly relies on chemical and photochemical methods. These methods must go through multiple processes such as photographic film, exposure, development and etching in the initial wiring process. With the rapid development of the electronic industry, higher requirements are put forward for the time, price and small-scale production capacity of product design and development. However, the traditional technology shows the disadvantages of too many processes and too long cycle time. [0003] Therefore, the laser direct writing technology in the electronics industry came into being. LPKF has invented a Laser Direct Structuring-LDS technology, which uses plastics added with a non-conductive organic metal compound as a raw material, and direct...

AI Technical Summary

Problems solved by technology

However, using this method for selective electroless plating involves the problem of silver pollution.

Since the silver nitrate, silver formate, silver acetate, silver propionate, and silver butyrate used in this patent are easy to decompose under sunlight and heat, it is easy to cause silver pollution in the non-laser radiation area during actual operation. Cleaning is also difficult to completely remove. After electroless copper plating, there will be some coatings on the non-laser radiation area on the surface of the substrate; in addition, by coating polyvinylpyrrolidone / silver colloid, and then using laser radiation to embed silver particles in the substrate, Cohesion of the coating is poor at the end of electroless plating